Thinning and singulation of silicon: Root causes of the damage in thin chips

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 1317-1322

  Kröninger, Werner ^a   Mariani, Franco ^a  

^a INFINEON TECHNOLOGIES AG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; CHIP SCALE PACKAGES; ELECTRIC RESISTANCE; MICROPROCESSOR CHIPS; PERSONAL COMPUTERS; SMART CARDS;

CHIP SABILITY; MEMORY CHIPS; SILICON CHIPS; WAFER THINNING;

SEMICONDUCTING SILICON;

EID: 33845561906     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645825     Document Type: Conference Paper

References (3)

1. Mechanik und Festigkeitslehre, A. Böge Vieweg Verlag, Braunschweig, 21. Aufl. 1990
2. Rotationsschleifen von Si-Wafern Promotion von Sabine Lehnicke, 1999 Institut für Fertigungstechnik Uni Hannover, Fortschrittsberichte VDI, Reihe 2, Nr. 534
3. Creating Stable and Flexible Chips for Thin Packages W. Kröninger, L. Schneider, G. Wagner Semiconductor International, Nov. 2004