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Volumn , Issue , 2011, Pages 167-183

Handling of thin dies with emphasis on chip-to-wafer bonding

Author keywords

[No Author keywords available]

Indexed keywords


EID: 84860891220     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_15     Document Type: Chapter
Times cited : (9)

References (3)
  • 3
    • 78651267894 scopus 로고    scopus 로고
    • Flip chip-to-wafer stacking: Enabling technology for volume production of 3D system integration on wafer level
    • Long Beach, California, US
    • Scheiring C, Kostner H, Lindner P, Pargfrieder S (2004) Flip chip-to-wafer stacking: Enabling technology for volume production of 3D system integration on wafer level. IMAPS Conference 2004, Long Beach, California, US
    • (2004) IMAPS Conference 2004
    • Scheiring, C.1    Kostner, H.2    Lindner, P.3    Pargfrieder, S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.