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Volumn , Issue , 2011, Pages 167-183
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Handling of thin dies with emphasis on chip-to-wafer bonding
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Author keywords
[No Author keywords available]
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Indexed keywords
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EID: 84860891220
PISSN: None
EISSN: None
Source Type: Book
DOI: 10.1007/978-1-4419-7276-7_15 Document Type: Chapter |
Times cited : (9)
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References (3)
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