Studies of chipping mechanisms for dicing silicon wafers

International Journal of Advanced Manufacturing Technology

Volumn 35, Issue 11-12, 2008, Pages 1206-1218

  Luo, S Y ^a   Wang, Z W ^a  

^a HUAFAN UNIVERSITY   (Taiwan)

Author keywords

Chipping; Dicing; Scratching; Silicon wafer; Slip directions and planes

Indexed keywords

CHIP SCALE PACKAGES; CRACKS; PLASTIC DEFORMATION; PRODUCTION ENGINEERING; SEMICONDUCTING DIAMONDS;

CHIPPING MODES; DICING SILICON WAFERS; PLASTIC PILES; SLIP DIRECTIONS AND PLANES;

SILICON WAFERS;

EID: 38149078763     PISSN: 02683768     EISSN: 14333015     Source Type: Journal    
DOI: 10.1007/s00170-006-0800-3     Document Type: Article

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