An overview of experimental methodologies and their applications for die strength measurement

IEEE Transactions on Components and Packaging Technologies

Volumn 26, Issue 2, 2003, Pages 423-428

  Yeung, Betty ^a   Lee, Tien Yu Tom ^a  

^a MOTOROLA INC   (United States)

Author keywords

Ball breaker; Four point; Singulation; Three point; Wafer thinning

Indexed keywords

BENDING STRENGTH; DIES; FAILURE ANALYSIS; OPTIMIZATION; RELIABILITY; SILICON WAFERS;

BALL BREAKER; DIE STRENGTH MEASUREMENT; PACKAGE SIZE; WAFER THINNING;

ELECTRONICS PACKAGING;

EID: 0042887578     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2003.815111     Document Type: Article

References (7)

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