Mechanical characterization in failure strength of silicon dice

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 2, Issue , 2004, Pages 203-210

  Chong, Desmond Y R ^a   Lee, W E ^b   Lim, B K ^a   Pang, John H L ^b   Low, T H ^a  

^a United Test and Assembly Center Ltd   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Backgrinding pattern; Die failure strength; Edge defect; Fracture of silicon; Surface defect; Three point bending test; Wafer processing

Indexed keywords

BACKGRINDING PATTERN; DIE FAILURE; FRACTURE OF SILICON; SURFACE DEFECTS; THREE-POINT BENDING TEST; WAFER PROCESSING;

CRACKS; DEFECTS; DIES; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; FRACTURE MECHANICS; STRESSES;

SILICON WAFERS;

EID: 4444362190     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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