Fracture toughness, adhesion and mechanical properties of low-K dielectric thin films measured by nanoindentation

Thin Solid Films

Volumn 429, Issue 1-2, 2003, Pages 201-210

  Volinsky, Alex A ^a   Vella, Joseph B ^a   Gerberich, William W ^b  

^a MOTOROLA INC   (United States)

^b University of Minnesota   (United States)

Author keywords

Adhesion; Fracture toughness; Low k dielectrics; Mechanical properties; Nanoindentation

Indexed keywords

ADHESION; CRACK PROPAGATION; FRACTURE TOUGHNESS; INDENTATION;

ORGANO-SILICATE GLASS (OSG);

DIELECTRIC FILMS;

EID: 0038713226     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(03)00406-1     Document Type: Article

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