Low K Adhesion issues in Cu/Low K integration

Proceedings of the IEEE 1999 International Interconnect Technology Conference, IITC 1999

Volumn , Issue , 1999, Pages 161-163

  Allada, Sudhakar ^a  

^a SEMATECH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CHEMICAL MECHANICAL POLISHING; DELAMINATION;

COPPER CMP; CU/LOW-K; DESIGNED EXPERIMENTS; SUBSTRATE ADHESION;

LOW-K DIELECTRIC;

EID: 84962822452     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.1999.787109     Document Type: Conference Paper

References (1)

1. Dr. Ed Shaffer, et al, MRS April 14-16, 1998, San Francisco, CA. page 133-135.