System-in-foil technology

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 141-157

  Dietzel, Andreas ^a   Van Den Brand, Jeroen ^a   Vanfleteren, Jan ^b   Christiaens, Wim ^b   Bosman, Erwin ^b   De Baets, Johan ^b  

^a HOLST CENTRE   (Netherlands)

^b IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84864248067     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_13     Document Type: Chapter

References (11)

1. Polymer Vision product announcement. www.readius.com
2. Stella project home page www.stella-project.de
3. van den Brand J, de Baets J, van Mol T et al (2008) Systems-in-foil: devices, fabrication processes and reliability issues. Microelectron Reliab 48(8-9):1123-1128
4. Fjelstad J (2007) Flexible circuit technology. BR Publishing, Seaside
5. Greener J, Ng KC, Vaeth KM et al (2007) Moisture permeability through multilayered barrier films as applied to flexible OLED display. J Appl Polym Sci 106(5):3534-3542
6. Govaerts J, Bosman E, Christiaens W, Vanfleteren J (2010) Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology. IEEE Trans Adv Packag 33(1):72-78
7. Niklaus F, Enoksson P, Kälvesten E, Stemme G (2001) Low-temperature full wafer adhesive bonding. J Micromech Microeng 11:100-107
8. Christiaens W, Torfs T, Huwel W, Van Hoof C and Vanfleteren J (2009) 3D integration of ultra-thin functional devices inside standard multilayer flex laminates. 2009 European microelectronics and packaging conference (EMPC 2009), vol 1 and 2, Rimini, 16-18 June, pp 671-675
9. van den Brand J, Kusters R, Barink M, Dietzel A (2010) Flexible embedded circuitry: a novel process for high density, cost effective electronics. Microelectron Eng 87(10):1861-1867. doi:10.1016/j.mee.2009.11.004, available online
10. Bosman E, Van Steenberge G, Van Hoe B et al (2010) Highly reliable flexible active optical links. IEEE Photonics Technol Lett 22(5):287-289
11. Bona GL, Offrein BJ, Bapst U, Berger C, Beyeler R, Budd R, Dangel R, Dellmann L, Horst F (2004) Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board. Proc SPIE 5453:134-141