4 mil DAF die thickness sawing capability study

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium

Volumn , Issue , 2006, Pages 207-219

  Wang, S W ^a   Yo, M C ^a  

^a ON Semiconductor SCG Industries M Sdn Bhd Malaysia   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELECTRIC CURRENTS; LAMINATING; MANUFACTURE; TECHNOLOGY;

DIE ATTACH; ELECTRONICS MANUFACTURING; FEED SPEED; INTERNATIONAL CONFERENCES; SAW PROCESS; SINGLE PASS; THICKNESS REDUCTION; WAFER DICING; WAFER HANDLING; WAFER THICKNESSES;

SAWING;

EID: 45749100692     PISSN: 10898190     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMT.2006.4456457     Document Type: Conference Paper

References (7)

1. Disco Blade Seminar (Advanced Version).
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3. Gideon Levinson. Process Optimization of Dicing Microelectronic Substrates, Kulicke & Soffa Technical Library.
4. Werner Kroninger & Ludwig Schneider. From Wafers to Chips: The Challenge of Process Control in Dicing,Future Fab International.
5. Ilan Weisshaus. Maintaining Yield is a Saw Point, European Semiconductor July 2000.
6. K. Gilleo, T. Cinque, S.Corbett, M.Corey, C.Lee & R.Miculich. Thermoplastic Die Attach Adhesive for Today's Packaging Challenges, Jersey City, NY.
7. Jian Jiang, Chunian Song & Zhenglin Zhang. Dicing Technology In Super-Thin wafer for IC. Wuxi China Resources Microelectronics, China.