Water jet guided laser vs. saw dicing

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4977, Issue , 2003, Pages 75-85

  Dushkina, Natalia ^a   Wagner, Frank R ^b   Boillat, Christophe ^b   Buchilly, Jean Marie ^b   Richerzhagen, Bernold ^b  

^a Laboratory of Laser Applications   (United States)

^b Synova SA   (Switzerland)

Author keywords

Laser cutting; Q switched Nd:YAG laser; Semiconductor wafers; Water jet

Indexed keywords

FRACTURE TOUGHNESS; HEAT AFFECTED ZONE; NEODYMIUM LASERS; OPTICAL FIBERS; Q SWITCHED LASERS; REFLECTION; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; THERMAL EFFECTS;

KERF QUALITY; SAW DICING; SINGULATION PROCESS; TOTAL INTERNAL REFLECTION; WATER JET GUIDED LASER;

LASER BEAM CUTTING;

EID: 0344862001     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.479414     Document Type: Conference Paper

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