A study on the characteristic of UV curved die-attach films in stack CSP (Chip Scale Package)

Proceedings of the International Conference on Microelectronics, ICM

Volumn 2003-January, Issue , 2003, Pages 365-368

  Chung, C L ^a   Fu, S L ^a   Lin, T ^b   Lu, A ^b   Ho, M ^b   Kuo, D ^b   Chou, S ^b  

^a I SHOU UNIVERSITY   (Taiwan)

^b ChipMOS Technologies   (Taiwan)

Author keywords

Chemicals; Chip scale packaging; Failure analysis; History; Microassembly; Optical microscopy; Process design; Scanning electron microscopy; Testing; Thermal stability

Indexed keywords

CHEMICAL ANALYSIS; CHEMICAL BONDS; CHEMICAL STABILITY; CHEMICALS; CURING; DIES; DIFFERENTIAL SCANNING CALORIMETRY; FAILURE (MECHANICAL); FAILURE ANALYSIS; GRAVIMETRIC ANALYSIS; HISTORY; MICROELECTRONICS; OPTICAL MICROSCOPY; PROCESS DESIGN; RELIABILITY; SCANNING ELECTRON MICROSCOPY; TESTING; THERMODYNAMIC STABILITY; THERMOGRAVIMETRIC ANALYSIS; TOMOGRAPHY;

CHIP-SCALE PACKAGING; ELECTRONIC MICROSCOPY; FAILURE MECHANISM; MICRO ASSEMBLY; OPTICAL MICROSCOPES; RELIABILITY TEST; THERMAL CYCLE TESTS; THERMAL MECHANICAL ANALYZERS;

CHIP SCALE PACKAGES;

EID: 84945243987     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICM.2003.237967     Document Type: Conference Paper

References (7)

1. John H. Lau, 'Chip on board technologies for mulitchip modules', Van Nostrand Reinhold, New York, NY, Chapter 6, pp. 251-274, 1994
2. nd IEEE Electronic Components and Technology Conference, pp. 487-491, 1992
3. nd IEEE Electronic Components and Technology Conference, pp. 487-491, 1992
4. Estes, R. H., 'A practical approach to die attach adhesive selection', Hybrid Circuit Technology, pp. 44-47, June 1991.
5. Timmy Lin, ChipMOS internal report, RP-2710-98026, May, 2003.
6. Debby Kuo, ChipMOS internal report, ML-030803, Aug, 2003.
7. Alex Lu, ChipMOS Reliability report, No: QA4 - R307019, July, 2003.