Heat damage-free Laser-Microjet cutting achieves highest die fracture strength

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 5713, Issue , 2005, Pages 285-292

  Perrottet, Delphine ^a   Housh, Roy ^a   Richerzhagen, Bernold ^a   Manley, John ^b  

^a Synova SA   (Switzerland)

^b Synova USA Inc   (United States)

Author keywords

Die fracture strength; Heat affected zone; Laser cutting; Silicon; Water jet guided laser

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CUTTING; ETCHING; FRACTURE TOUGHNESS; HEAT AFFECTED ZONE; MICROCRACKING; SAWING; SEMICONDUCTOR MATERIALS; SILICON; SILICON WAFERS; SOLID STATE LASERS;

DIE FRACTURE STRENGTH; HEAT DAMAGE; LASER CUTTING; WATER JET GUIDED LASERS;

LASER APPLICATIONS;

EID: 23744454781     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.586710     Document Type: Conference Paper

References (0)