Challenges in the assembly and handling of thin film capped MEMS devices

Sensors

Volumn 10, Issue 4, 2010, Pages 3989-4001

  Zaal, Jeroen J M ^a   van Driel, Willem D ^a   Zhang, G Q ^a  

^a DELFT UNIVERSITY OF TECHNOLOGY   (Netherlands)

Author keywords

MEMS; Packaging; Resonator; Wafer level thin film package

Indexed keywords

ASSEMBLY PROCESS; CONCURRENT DESIGN; MANUFACTURABILITY; MEMS APPLICATIONS; MEMSDEVICES; NUMERICAL CALCULATION; THIN FILM PACKAGE; WAFER LEVEL;

MEMS; PACKAGING; RESONATORS;

RISK PERCEPTION;

EID: 77951699919     PISSN: 14248220     EISSN: None     Source Type: Journal    
DOI: 10.3390/s100403989     Document Type: Review

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