Ultra-thin wafer fabrication through dicing-by-thinning

Ultra-thin Chip Technology and Applications

Volumn , Issue , 2011, Pages 33-43

  Landesberger, Christof ^a   Scherbaum, Sabine ^a   Bock, Karlheinz ^b  

^a Fraunhofer Institut fur Festkorpertechnologie   (Germany)

^b Datacon Technology GmbH   (Austria)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 84864258340     PISSN: None     EISSN: None     Source Type: Book    
DOI: 10.1007/978-1-4419-7276-7_4     Document Type: Chapter

References (13)

1. Landesberger C, Klink G, Schwinn G, Aschenbrenner R (2001) New dicing and thinning concept improves mechanical reliability of ultra thin silicon. In: International symposium and exhibition on advanced packaging materials, Braselton, 92-97 March 2001
2. Landesberger C, Feil M, Klumpp A. Method of subdividing a wafer. US Patent 6, 756, 288 B1, European patent EP 1 192 657 B1
3. Landesberger C, Köthe O, Bleier M. Verfahren zum Bearbeiten eines Wafers. German Patent, DE 102 29 499 B4
4. Schönfelder S, Ebert M, Landesberger C, Bock K, Bagdahn J (2007) Investigations of the influence of dicing techniques on the strength properties of thin silicon. Microelectron Reliab 47:168-178
5. Heinze P, Amberger M, Chabert T (2008) Perfect chips: chip-side-wall stress relief boosts stability. Future Fab Int 25:111-117
6. Takyu S, Sagara J, Kurosawa T (2008) A study on chip thinning for ultra thin memory devices. In: Electronics components and technology conference (ECTC), Lake Buena Vista, 1511-1516.
7. Usami M (2004) An ultra-small RFID chip: m-chip. In: 2004 IEEE Asia-Pacific conference on advanced system integrated circuits (AP-ASIC2004), 4-5 Aug. 2004
8. Feil M, Adler C, Hemmetzberger D, Bock K (2004) The challenge of ultra-thin chip assembly. In: Electronics components and technology conference (ECTC), Las Vegas, NV, USA
9. Smith JS. Fluidic self-assembly of active antenna. US Patent 6, 611, 237 B2
10. Bock K. European Patent application EP 1 499 168 A2
11. Bock K, Scherbaum S, Yacoub-George E, Landesberger C (May 2008) Selective one-step plasma patterning process for fluidic self-assembly of silicon chips. In: Electronic components and technology conference (ECTC), Lake Buena Vista, 1099-1104.
12. Landesberger C, Hell W, Yacoub-George E, Scherbaum S, König M, Feil M, Bock K (June 2009) Assembly of thin and flexible silicon devices on large area foil substrates. In: International conference and exhibition for the organic and printed electronics industry, Frankfurt
13. Landesberger C (ed) (2010) Entwicklung eines Selbstmontage-Verfahrens (self-assembly) für die Systemintegration von sehr kleinen Silizium-Bausteinen. Abschlussbericht des BMBF Verbundvorhabens Assemble!, Fortschritt-Berichte VDI. 9 (386)