Laser helical drilling of silicon wafers with ns to fs pulses: Scanning electron microscopy and transmission electron microscopy characterization of drilled through-holes

Journal of Laser Applications

Volumn 18, Issue 2, 2006, Pages 85-92

  Kaspar, J ^a   Luft, A ^a   Nolle, S ^b   Will, M ^b   Beyer, E ^a  

^a FRAUNHOFER INSTITUTE FOR MATERIAL AND BEAM TECHNOLOGY IWS   (Germany)

^b FRIEDRICH SCHILLER UNIVERSITY JENA   (Germany)

Author keywords

Electron microscopy (SEM and TEM); Laser helical drilling; Mechanisms of material removal and redeposition; Microstructure; Silicon; Ultrashort laser pulses

Indexed keywords

DRILLING; LASER PULSES; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY; ULTRASHORT PULSES;

DEFECT GENERATION; LASER HELICAL DRILLING; MATERIAL DEGRADATION;

SILICON WAFERS;

EID: 33845671872     PISSN: 1042346X     EISSN: None     Source Type: Journal    
DOI: 10.2351/1.2164480     Document Type: Article

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