Laser dicing and subsequent die strength enhancement technologies for ultra-thin wafer

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 761-766

  Li, Jianhua ^a   Hwang, Hyeon ^a   Ahn, Eun Chul ^a   Chen, Qiang ^a   Kim, Pyoungwan ^a   Lee, Teakhoon ^a   Chung, Myeongkee ^a   Chung, Taegyeong ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

LASER PULSES; MICROMACHINING; RESIDUAL STRESSES; ULTRATHIN FILMS;

LASER DICING; LASER PRECISION MICROMACHINING; ULTRA-THIN WAFERS;

SILICON WAFERS;

EID: 35348879081     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.373883     Document Type: Conference Paper

References (5)

1. Chong D. Y. R., Lee W. E., Lim B. K., and Pang J. H. L., Low T. H., "Meclianical Characterization in Failure Strength of Silicon Dice," Inter Society Conference on Thermal Phenomena, 2004, pp.203-210.
2. Takyu S., Kurosawa T., Shimizu N., and Harada S., "Novel Wafer Dicing and Chip Thinning Technologies Realizing High Chip Strength,*' 56,h Electronic Components and Technology Conference, San Diego, 2006, pp. 1623-1627.
3. th Electronic Components and Technology Conference, San Diego, 2006, pp. 1317-1322.
4. 2 Laser Cutting, 2nd ed. Springer, ISBN 3540-19786-9.
5. Hwang H., Ann E. C., Li J. H., Kim P. W., Lee T. H., and Chung T. G., "Laser Dicing Technology for Ultra Thin Wafer/Die in Electronic Packaging," International Conference on Electronics Packaging, Tokyo Japan, April. 2007, in press.