Review of packaging of optoelectronic, photonic, and MEMS components

IEEE Journal on Selected Topics in Quantum Electronics

Volumn 17, Issue 3, 2011, Pages 704-719

  Tekin, Tolga ^a  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

Author keywords

Microelectromechanical systems (MEMS); optoelectronic; packaging; photonics

Indexed keywords

CORE TECHNOLOGY; HETEROGENEOUS INTEGRATION; OPTOELECTRONIC; RECENT TRENDS; RESEARCH RESULTS; STANDARD TECHNOLOGY;

MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; PACKAGING;

COMPOSITE MICROMECHANICS;

EID: 79958260332     PISSN: 1077260X     EISSN: None     Source Type: Journal    
DOI: 10.1109/JSTQE.2011.2113171     Document Type: Review

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