Laser dicing of silicon: Comparison of ablation mechanisms with a novel technology of thermally induced stress

Journal of Laser Micro Nanoengineering

Volumn 3, Issue 3, 2007, Pages 135-140

  Haupt, Oliver ^a   Siegel, Frank ^a   Schoonderbeek, Aart ^a   Richter, Lars ^a   Kling, Rainer ^a   Ostendorf, Andreas ^a  

^a LASER ZENTRUM HANNOVER E V   (Germany)

Author keywords

Bending strength; Cutting; Laser; Silicon; Thermally induced stress

Indexed keywords

EID: 84923210915     PISSN: None     EISSN: 18800688     Source Type: Journal    
DOI: 10.2961/jlmn.2008.03.0002     Document Type: Article

References (13)

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