Stress release increases advantages of laser- microjet dicing

Semiconductor International

Volumn 28, Issue 4, 2005, Pages

  Kröninger, Werner ^a   Perrottet, Delphine ^b   Buchilly, Jean Marie ^b   Richerzbagen, Bernold ^b  

^a INFINEON TECHNOLOGIES AG   (Germany)

^b Synova SA   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

FORCE MEASUREMENT; FRACTURE TOUGHNESS; HEAT AFFECTED ZONE; JETS; LASER BEAMS; MICROELECTRONICS; MICROMACHINING; SEMICONDUCTOR DEVICE MODELS; STRESS ANALYSIS;

DIE FRACTURE STRENGTH; SRESS-RELEASE METHOD; WATER CHAMBER; WATER-JET-GUIDED LASER TECHNOLOGY;

LASER APPLICATIONS;

EID: 17144390212     PISSN: 01633767     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Review

References (0)