Overview and emerging challenges in mechanical dicing of silicon wafers

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2006, Pages 15-21

  Ganesh, V P ^a   Lee, Charles ^a  

^a INFINEON TECHNOLOGIES ASIA PACIFIC PTE LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; COPPER; ELECTRONICS PACKAGING; NONMETALS; SILICON; SILICON WAFERS; TECHNOLOGY;

CHIP STRENGTH; COPPER (CU); EMERGING TECHNOLOGIES; MECHANICAL DICING; PACKAGING TECHNOLOGIES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50249102910     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2006.342684     Document Type: Conference Paper

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