Laser ablation of silicon wafer with a water microdrop

Journal of Laser Applications

Volumn 18, Issue 2, 2006, Pages 127-130

  Shimizu, Kouki ^a   Takahashi, Kunimitsu ^a   Morikazu, Hiroshi ^b   Ogoshi, Nobumori ^b   Takeyama, Koichi ^b   Wakayama, Yoji ^c   Obara, Tetsuro ^d  

^a INSTITUTE OF RESEARCH AND INNOVATION   (Japan)

^b DISCO CORPORATION   (Japan)

^c LINTEC CORPORATION   (Japan)

^d SAITAMA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

LASER ABLATION; NEODYMIUM LASERS; Q SWITCHED LASERS; SURFACE STRUCTURE;

ABLATION POINT; DELAY TIME; SPATTERING; WATER MICRODROP;

SILICON WAFERS;

EID: 33845681261     PISSN: 1042346X     EISSN: None     Source Type: Journal    
DOI: 10.2351/1.2193178     Document Type: Article

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