Evaluation for UV laser dicing process and its reliability for various designs of stack chip scale package

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 1531-1536

  Kim, Do Hyung ^a   Kim, Yoon Joo ^a   Seong, Kyeong Sool ^a   Song, Jae Kyu ^a   Kim, Bong Chan ^a   Hwang, Chan Ha ^a   Lee, Choon Heong ^a  

^a Amkor Technology Korea Inc   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CONVENTIONAL BLADES; DIAMOND BLADE SAWING; DIAMOND BLADES; DIE STACKING; HIGH DENSITY; LASER GROOVING; LATERAL CRACKS; MASS PRODUCTION; MEMORY DEVICE; PROCESS SPEED; PROCESSING METHOD; QUALITY PROBLEMS; SEMI-CONDUCTOR MARKET; SI WAFER; TEMPERATURE CYCLES; THIN WAFERS; ULTRA LOW-K; ULTRA-THIN; UV LASERS; WAFER SAWING;

CHIP SCALE PACKAGES; CRACKS; DIES; LASERS; MILLING CUTTERS; PACKAGING; PRODUCTION ENGINEERING; PRODUCTIVITY; SAWING; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR INSULATOR BOUNDARIES; SEMICONDUCTOR LASERS; TECHNOLOGY; THROUGHPUT;

SILICON WAFERS;

EID: 70349695831     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074216     Document Type: Conference Paper

References (5)

1. th ECTC, San Diego, 2006, pp.1623-1627.
2. Todd Linotte, "Laser Dicing og Chip Scale and Silicon Wafer Scale Packages," IEEE/CPMT/SEMI Int'l Electronics Manufacturing Technology Symposium, 2003.
3. th ECTC, San Diego, 2006, pp.1317-1322.
4. Wiliam M. Steen, "Laser Material Processing," Third Edition, Springer, pp.107-125.
5. th ECTC, San Diego, 2007, pp.761- 766.