Materials challenges in planarization and interconnect technologies

ICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

Volumn , Issue , 2007, Pages 111-116

  Moinpour, Mansour ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARBON NANOTUBES; DELAY CIRCUITS; INTEGRATED CIRCUIT INTERCONNECTS; LOW-K DIELECTRIC; POROUS MATERIALS; RADIATION DAMAGE;

CAPACITIVE COUPLING NOISE; DEVELOPMENT ACTIVITY; DUAL DAMASCENE PROCESS; INTEGRATED CIRCUIT DEVICES; INTERCONNECT TECHNOLOGY; MECHANICAL DAMAGES; PERFORMANCE GAPS; POST-DEPOSITION;

DIELECTRIC MATERIALS;

EID: 84864264776     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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