Determination of silicon die strength

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2005, Pages 1155-1162

  Tsai, M Y ^a   Lin, C S ^a  

^a CHANG GUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; CRACK INITIATION; DIES; ELASTICITY; FATIGUE OF MATERIALS; INTEGRATED CIRCUITS; MICROPROCESSOR CHIPS; SINGLE CRYSTALS; STRENGTH OF MATERIALS; THERMAL LOAD;

LINE-LOAD TESTS; PLATE-ON-ELASTIC-FOUNDATION TEST (PEFT); SILICON DIES; TEMPERATURE LOADING;

SILICON;

EID: 24644475384     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

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2. Hu, K., Yeh, C. P., Doot, B., Skipor, A. F., and Wyatt, K. W., "Die Cracking in Flip Chip on Board Assembly," Proc. 45th Electron. Comp. Technol. Conf. May (1995), pp.293-299.
3. Tsai, M. Y., Hsu, C. H. and Wang, C. T., "Investigation of Thermo-Mechanical Behaviors of Flip Chip BGA in IC Packaging," IEEE Transactions on Components and Packaging Technologies Vol. 27, No. 3, (2004), pp.568-576.
4. Yeung, B.H., Hause, V., and Lee, T.Y.T.," Assessment of Backside Processes Through Die Strength Evaluation," IEEE Transactions on Advanced Packaging, Vol.23, No.3, (2000), pp.582-587.
5. Yeung, B. H., and Lee, T.Y.T., "An Overview of Experimental Methodologies and Their Applications Die Strength," IEEE Transactions on Advanced Packaging, Vol.26, No.2, (June 2003), pp.423-428.
6. Cotterell, B., Chen, Z., Han, J. B., and Tan, N. X., "The Strength of the Silicon Die in Flip-Chip Assemblies," ASME Journal of Electronic Packaging, Vol. 125, (Mar. 2003), pp. 114-119.
7. McLellan, N. Fan, N., Liu, S., Lau, K.,and Wu, J.,"Effect of Wafer Thinning Condition on the Roughness, Morphology and Fracture Strength of Silicon Die, "ASME Journal of Electronic Packaging, Vol.126, (2004), pp. 110-114.