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Volumn 257, Issue 23-24, 2013, Pages 3254-3270

Energy-enhanced atomic layer deposition for more process and precursor versatility

Author keywords

3c2e; iPr; tBu; ALD; Atomic layer deposition; BDEAS; CCP; Cp; CpMe; Cpx; DFT; DMAI; Eads; Energy enhanced ALD; Et; FT IR; GPC; ICP; MBE; Me; Ozone based ALD; Plasma enhanced ALD; Precursors; RF; RT; RT ALD; RTP; S OH; Thd; Ti N Prime; Ti Prime; Ti Star; TMA; TTIP

Indexed keywords


EID: 84885482308     PISSN: 00108545     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ccr.2013.06.015     Document Type: Review
Times cited : (90)

References (201)
  • 76
    • 51349144248 scopus 로고    scopus 로고
    • Low Temperature Plasmas: Fundamentals
    • Wiley-VCH, Weinheim
    • Kogelschatz U., Salge J. Low Temperature Plasmas: Fundamentals. Technologies and Techniques 2008, vol. 2:439-462. Wiley-VCH, Weinheim. second ed.
    • (2008) Technologies and Techniques , vol.2 , pp. 439-462
    • Kogelschatz, U.1    Salge, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.