Integration of carrierless ultrathin wafers into a TSV process flow

2010 12th Electronics Packaging Technology Conference, EPTC 2010

Volumn , Issue , 2010, Pages 571-575

  Bieck, Florian ^a   Spiller, Sven ^a   Molina, Froilan ^a   Töpper, Michael ^b   Lopper, Christina ^b   Kuna, Ingrid ^b   Fischer, Thorsten ^b   Röder, Julia ^b   Dietrich, Lothar ^b   Tabuchi, Tomotaka ^c  

^a Fraunhofer IZM ^*  (Singapore)

^b FRAUNHOFER IZM   (Germany)

^c Disco HiTech Europe GmbH   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER WAFERS; CARRIER-LESS; LITHOGRAPHY PROCESS; PROCESS FLOWS; STANDARD EQUIPMENTS; STATE OF THE ART; THROUGH-SILICON-VIA; ULTRA-THIN; ULTRATHIN SILICON;

BONDING; ELECTRONICS PACKAGING; LITHOGRAPHY; MECHANICAL STABILITY; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

WAFER BONDING;

EID: 79951917753     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2010.5702703     Document Type: Conference Paper

References (10)

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