SCOPUS 정보 검색 플랫폼

Volumn 41, Issue 9, 2012, Pages 2631-2658

High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications

(5) Shnawah, Dhafer Abdulameer a Said, Suhana Binti Mohd a Sabri, Mohd Faizul Mohd a Badruddin, Irfan Anjum a Che, Fa Xing b

a UNIVERSITY OF MALAYA (Malaysia)

b INSTITUTE OF MICROELECTRONICS (Singapore)

Author keywords

drop impact; low Ag content; minor alloying elements; Sn Ag Cu solders; thermal cycling

Indexed keywords

BULK ALLOYS; DROP IMPACT; DROP TESTING; ELECTRONICS APPLICATIONS; GROWTH SUPPRESSIONS; HIGH COSTS; HIGH-RELIABILITY; INTERFACE INTERMETALLIC COMPOUNDS; LEAD-FREE SOLDER ALLOY; LOW AG CONTENT; RESEARCH REPORTS; SAC ALLOY; SAC-SOLDERS; SN-AG-CU; SNAGCU SOLDER; SOLDER JOINT RELIABILITY; SOLDER JOINTS; WETTING PROPERTY;

ALLOYING; ALLOYING ELEMENTS; ALLOYS; ANTIMONY COMPOUNDS; COBALT COMPOUNDS; DROPS; ELECTRONICS INDUSTRY; MANGANESE; MECHANICAL PROPERTIES; RELIABILITY; SILVER; SOLDERING ALLOYS; THERMAL CYCLING; TIN; TIN ALLOYS; ZINC;

SILVER ALLOYS;

EID: 84865275757 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-012-2145-z Document Type: Review

Times cited : (85)

References (191)

1
- 51549112537
- IEEE Phoenix, AZ
- D.R. Frear, L.N. Ramanathan, J.-W. Jang, and N.L. Owens, Proceedings of the International Reliability Physics Symposium (Phoenix, AZ: IEEE, 2008), p. 450.
- (2008) Proceedings of the International Reliability Physics Symposium , pp. 450
- Frear, D.R.¹ Ramanathan, L.N.² Jang, J.-W.³ Owens, N.L.⁴

2
- 33845715988
- 1:CAS:528:DC%2BD28XhtlWntLvP 10.1007/s10854-006-9024-4
- KJ Puttlitz GT Galyon 2007 J. Mater. Sci. Mater. Electron. 18 347 1:CAS:528:DC%2BD28XhtlWntLvP 10.1007/s10854-006-9024-4
- (2007) J. Mater. Sci. Mater. Electron. , vol.18 , pp. 347
- Puttlitz, K.J.¹ Galyon, G.T.²

3
- 0033098524
- 1:CAS:528:DyaK1MXis1Snu7k%3D 10.1007/s11837-999-0023-9
- DR Frear 1999 JOM 51 3 22 1:CAS:528:DyaK1MXis1Snu7k%3D 10.1007/s11837-999-0023-9
- (1999) JOM , vol.51 , Issue.3 , pp. 22
- Frear, D.R.¹

4
- 0003511126
- McGraw-Hill New York
- J.H. Lau, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (New York: McGraw-Hill, 2000).
- (2000) Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
- Lau, J.H.¹

5
- 0003794788
- Chapman & Hall New York
- J.H. Lau, Chip on Board Technologies for Multichip Modules (New York: Chapman & Hall, 1994).
- (1994) Chip on Board Technologies for Multichip Modules
- Lau, J.H.¹

6
- 33845710415
- L Garner S Sane D Suh T Byrne A Dane T Martin M Mello M Patel R William 2009 Intel Technol. J. 9 297
- (2009) Intel Technol. J. , vol.9 , pp. 297
- Garner, L.¹ Sane, S.² Suh, D.³ Byrne, T.⁴ Dane, A.⁵ Martin, T.⁶ Mello, M.⁷ Patel, M.⁸ William, R.⁹

7
- 84927681978
- ed. S. Kasap and P. Capper (New York: Springer)
- D.R. Frear, Packaging Materials, ed. S. Kasap and P. Capper (New York: Springer, 2007), p. 1267.
- (2007) Packaging Materials , pp. 1267
- Frear, D.R.¹

8
- 33845692077
- 1:CAS:528:DC%2BD28XhtlWntLvN 10.1007/s10854-006-9031-5
- CE Ho SC Yang CR Kao 2007 J. Mater. Sci. Mater. Electron. 18 155 1:CAS:528:DC%2BD28XhtlWntLvN 10.1007/s10854-006-9031-5
- (2007) J. Mater. Sci. Mater. Electron. , vol.18 , pp. 155
- Ho, C.E.¹ Yang, S.C.² Kao, C.R.³

9
- 84865218426
- SC Yang CE Ho CW Chang CR Kao 2007 J. Appl. Phys. 101 1
- (2007) J. Appl. Phys. , vol.101 , pp. 1
- Yang, S.C.¹ Ho, C.E.² Chang, C.W.³ Kao, C.R.⁴

10
- 0035455438
- 1:CAS:528:DC%2BD3MXntFWqtrk%3D 10.1007/s11664-001-0148-2
- Y Kariya T Morihata E Hazawa M Otsuka 2001 J. Electron. Mater. 30 1184 1:CAS:528:DC%2BD3MXntFWqtrk%3D 10.1007/s11664-001-0148-2
- (2001) J. Electron. Mater. , vol.30 , pp. 1184
- Kariya, Y.¹ Morihata, T.² Hazawa, E.³ Otsuka, M.⁴

11
- 33644898836
- 1:CAS:528:DC%2BD28Xit1Shs7k%3D 10.1007/BF02692449
- C Lin C Huang 2006 J. Electron. Mater. 35 292 1:CAS:528: DC%2BD28Xit1Shs7k%3D 10.1007/BF02692449
- (2006) J. Electron. Mater. , vol.35 , pp. 292
- Lin, C.¹ Huang, C.²

12
- 33644921774
- 1:CAS:528:DC%2BD28Xit1Shs78%3D 10.1007/BF02692443
- TT Mattila JK Kivilahti 2006 J. Electron. Mater. 35 250 1:CAS:528:DC%2BD28Xit1Shs78%3D 10.1007/BF02692443
- (2006) J. Electron. Mater. , vol.35 , pp. 250
- Mattila, T.T.¹ Kivilahti, J.K.²

13
- 33646383102
- 1:CAS:528:DC%2BD28XksF2jur4%3D 10.1016/j.microrel.2005.10.011
- DYR Chong FX Che JHL Pang K Ng JYN Tan PTH Low 2006 Microelectron. Reliab. 46 1160 1:CAS:528:DC%2BD28XksF2jur4%3D 10.1016/j.microrel.2005.10.011
- (2006) Microelectron. Reliab. , vol.46 , pp. 1160
- Chong, D.Y.R.¹ Che, F.X.² Pang, J.H.L.³ Ng, K.⁴ Tan, J.Y.N.⁵ Low, P.T.H.⁶

14
- 55849123626
- 1:CAS:528:DC%2BD1cXhtlyjtrzN 10.1016/j.microrel.2008.08.006
- EH Wong SKW Seah VPW Shim 2008 Microelectron. Reliab. 48 1747 1:CAS:528:DC%2BD1cXhtlyjtrzN 10.1016/j.microrel.2008.08.006
- (2008) Microelectron. Reliab. , vol.48 , pp. 1747
- Wong, E.H.¹ Seah, S.K.W.² Shim, V.P.W.³

15
- 67349228728
- 1:CAS:528:DC%2BD1MXlslGhtbs%3D 10.1016/j.microrel.2009.02.024
- B Zhang H Ding X Sheng 2009 Microelectron. Reliab. 49 530 1:CAS:528:DC%2BD1MXlslGhtbs%3D 10.1016/j.microrel.2009.02.024
- (2009) Microelectron. Reliab. , vol.49 , pp. 530
- Zhang, B.¹ Ding, H.² Sheng, X.³

16
- 30144433622
- 1:CAS:528:DC%2BD2MXhtlequ73N 10.1007/s11664-005-0164-8
- J-W Kim D-G Kim WS Hong S-B Jung 2005 J. Electron. Mater. 34 1550 1:CAS:528:DC%2BD2MXhtlequ73N 10.1007/s11664-005-0164-8
- (2005) J. Electron. Mater. , vol.34 , pp. 1550
- Kim, J.-W.¹ Kim, D.-G.² Hong, W.S.³ Jung, S.-B.⁴

17
- 84954039444
- IEEE Singapore
- T.Y. Tee, H.S. Ng, and Z. Zhong, Proceedings of the 5th Electronics Packaging Technology Conference (Singapore: IEEE, 2003), p. 210.
- (2003) Proceedings of the 5th Electronics Packaging Technology Conference , pp. 210
- Tee, T.Y.¹ Ng, H.S.² Zhong, Z.³

18
- 0035365016
- 10.1109/6144.926396
- M Sumikawa T Sato C Yoshioka T Nukii 2001 IEEE Trans. Compon. Packag. Technol. 24 293 10.1109/6144.926396
- (2001) IEEE Trans. Compon. Packag. Technol. , vol.24 , pp. 293
- Sumikawa, M.¹ Sato, T.² Yoshioka, C.³ Nukii, T.⁴

19
- 84869507764
- doi: 10.1007/s10854-012-0692-y
- D.A.-A. Shnawah, M.F.M. Sabri, I.A. Badruddin, S.B.M. Said, and F.X. Che, J. Mater. Sci. Mater. Electron. (2012). doi: 10.1007/s10854-012-0692-y.
- (2012) J. Mater. Sci. Mater. Electron.
- Shnawah, D.A.-A.¹ Sabri, M.F.M.² Badruddin, I.A.³ Said, S.B.M.⁴ Che, F.X.⁵

20
- 36148957461
- 1:CAS:528:DC%2BD2sXhsVags7vN 10.1007/s11664-007-0260-z
- W Peng ME Marques 2007 J. Electron. Mater. 36 1679 1:CAS:528: DC%2BD2sXhsVags7vN 10.1007/s11664-007-0260-z
- (2007) J. Electron. Mater. , vol.36 , pp. 1679
- Peng, W.¹ Marques, M.E.²

21
- 59549101503
- 1:CAS:528:DC%2BD1MXhs1Cgsbc%3D 10.1016/j.microrel.2008.12.001
- EH Wong SKW Seah WDV Driel JFJM Caers N Owens Y-S Lai 2009 Microelectron. Reliab. 49 139 1:CAS:528:DC%2BD1MXhs1Cgsbc%3D 10.1016/j.microrel.2008.12.001
- (2009) Microelectron. Reliab. , vol.49 , pp. 139
- Wong, E.H.¹ Seah, S.K.W.² Driel, W.D.V.³ Jfjm, C.⁴ Owens, N.⁵ Lai, Y.-S.⁶

22
- 30844472660
- 1:CAS:528:DC%2BD28XlvV2ksA%3D%3D 10.1016/j.microrel.2005.07.005
- Y-S Lai P-F Yang C-L Yeh 2006 Microelectron. Reliab. 46 645 1:CAS:528:DC%2BD28XlvV2ksA%3D%3D 10.1016/j.microrel.2005.07.005
- (2006) Microelectron. Reliab. , vol.46 , pp. 645
- Lai, Y.-S.¹ Yang, P.-F.² Yeh, C.-L.³

23
- 0036134475
- 10.1016/S0026-2714(01)00230-X
- K Mishiro 2002 Microelectron. Reliab. 42 77 10.1016/S0026-2714(01)00230-X
- (2002) Microelectron. Reliab. , vol.42 , pp. 77
- Mishiro, K.¹

24
- 0038351732
- IEEE New Orleans, LA
- L. Zhu, Proceedings of the 53rd Electronic Components and Technology Conference (New Orleans, LA: IEEE, 2003), p. 100.
- (2003) Proceedings of the 53rd Electronic Components and Technology Conference , pp. 100
- Zhu, L.¹

25
- 84155160718
- 1:CAS:528:DC%2BC3MXhs1GrurfI 10.1016/j.microrel.2011.07.093
- DA-A Shnawah MFM Sabri IA Badruddin 2012 Microelectron. Reliab. 52 90 1:CAS:528:DC%2BC3MXhs1GrurfI 10.1016/j.microrel.2011.07.093
- (2012) Microelectron. Reliab. , vol.52 , pp. 90
- Da-A, S.¹ Sabri, M.F.M.² Badruddin, I.A.³

26
- 84858055485
- 1:CAS:528:DC%2BC38XnsFCrsro%3D 10.1108/13565361211219202
- DA-A Shnawah MFM Sabri IA Badruddin S Said 2012 Microelectron. Int. 29 1 47 1:CAS:528:DC%2BC38XnsFCrsro%3D 10.1108/13565361211219202
- (2012) Microelectron. Int. , vol.29 , Issue.1 , pp. 47
- Da-A, S.¹ Sabri, M.F.M.² Badruddin, I.A.³ Said, S.⁴

27
- 0038013577
- IEEE New Orleans, LA
- D. Xie, M. Arra, S. Yi, and D. Rooney, Proceedings of the 53rd Electronic Components and Technology Conference (New Orleans, LA: IEEE, 2003), p. 130.
- (2003) Proceedings of the 53rd Electronic Components and Technology Conference , pp. 130
- Xie, D.¹ Arra, M.² Yi, S.³ Rooney, D.⁴

28
- 84954043857
- IEEE Singapore. 10.1109/EPTC.2003.1271522
- J.E. Luan, T.Y. Tee, E. Pek, C.T. Lim, and Z.W. Zhong, Proceedings of the 5th Electronics Packaging Technology Conference (Singapore: IEEE, 2003), p. 233.
- (2003) Proceedings of the 5th Electronics Packaging Technology Conference , pp. 233
- Luan, J.E.¹ Tee, T.Y.² Pek, E.³ Lim, C.T.⁴ Zhong, Z.W.⁵

29
- 0035306684
- 1:CAS:528:DC%2BD3MXivValurY%3D 10.1007/s11664-001-0046-7
- KN Subramanian A Lee S Choi P Sonje 2001 J. Electron. Mater. 30 372 1:CAS:528:DC%2BD3MXivValurY%3D 10.1007/s11664-001-0046-7
- (2001) J. Electron. Mater. , vol.30 , pp. 372
- Subramanian, K.N.¹ Lee, A.² Choi, S.³ Sonje, P.⁴

30
- 7044265011
- 1:CAS:528:DC%2BD2cXosVymsLY%3D 10.1007/s11664-004-0125-7
- JL Pang L Xu XQ Shi W Zhou SL Ngoh 2004 J. Electron. Mater. 33 1219 1:CAS:528:DC%2BD2cXosVymsLY%3D 10.1007/s11664-004-0125-7
- (2004) J. Electron. Mater. , vol.33 , pp. 1219
- Pang, J.L.¹ Xu, L.² Shi, X.Q.³ Zhou, W.⁴ Ngoh, S.L.⁵

31
- 33645569588
- 1:CAS:528:DC%2BD28Xjt1Skurw%3D 10.1007/BF02690524
- D Li C Liu PP Conway 2006 J. Electron. Mater. 35 388 1:CAS:528: DC%2BD28Xjt1Skurw%3D 10.1007/BF02690524
- (2006) J. Electron. Mater. , vol.35 , pp. 388
- Li, D.¹ Liu, C.² Conway, P.P.³

32
- 0035455514
- 1:CAS:528:DC%2BD3MXntFWqsLY%3D 10.1007/s11664-001-0129-5
- IE Anderson JC Foley BA Cook J Harringa RL Terpstra O Unal 2001 J. Electron. Mater. 30 1050 1:CAS:528:DC%2BD3MXntFWqsLY%3D 10.1007/s11664-001-0129- 5
- (2001) J. Electron. Mater. , vol.30 , pp. 1050
- Anderson, I.E.¹ Foley, J.C.² Cook, B.A.³ Harringa, J.⁴ Terpstra, R.L.⁵ Unal, O.⁶

33
- 0942299489
- 1:CAS:528:DC%2BD2cXlsV2itA%3D%3D 10.1007/s11664-003-0125-z
- S Terashima Y Kariya T Hosoi M Tanaka 2003 J. Electron. Mater. 32 1527 1:CAS:528:DC%2BD2cXlsV2itA%3D%3D 10.1007/s11664-003-0125-z
- (2003) J. Electron. Mater. , vol.32 , pp. 1527
- Terashima, S.¹ Kariya, Y.² Hosoi, T.³ Tanaka, M.⁴

34
- 51649133658
- 1:CAS:528:DyaK2cXntVGqt7k%3D 10.1007/BF02653344
- CM Miller IE Anderson JF Smith 1994 J. Electron. Mater. 23 595 1:CAS:528:DyaK2cXntVGqt7k%3D 10.1007/BF02653344
- (1994) J. Electron. Mater. , vol.23 , pp. 595
- Miller, C.M.¹ Anderson, I.E.² Smith, J.F.³

35
- 57649171539
- 1:CAS:528:DC%2BD1cXhsV2qu7vM 10.1007/s11664-008-0560-y
- S Terashima T Kohno A Mizusawa K Arai O Okada T Wakabayashi M Tanaka K Tatsumi 2009 J. Electron. Mater. 38 33 1:CAS:528:DC%2BD1cXhsV2qu7vM 10.1007/s11664-008-0560-y
- (2009) J. Electron. Mater. , vol.38 , pp. 33
- Terashima, S.¹ Kohno, T.² Mizusawa, A.³ Arai, K.⁴ Okada, O.⁵ Wakabayashi, T.⁶ Tanaka, M.⁷ Tatsumi, K.⁸

36
- 42449093723
- 1:CAS:528:DC%2BD1cXkvF2gu74%3D 10.1007/s11664-008-0400-0
- L Xu JHL Pang F Che 2008 J. Electron. Mater. 37 880 1:CAS:528: DC%2BD1cXkvF2gu74%3D 10.1007/s11664-008-0400-0
- (2008) J. Electron. Mater. , vol.37 , pp. 880
- Xu, L.¹ Pang, J.H.L.² Che, F.³

37
- 59849087279
- 1:CAS:528:DC%2BD1MXhsFOmsbs%3D 10.1007/s11664-008-0633-y
- T You Y Kim J Kim J Lee B Jung J Moon H Choe 2009 J. Electron. Mater. 38 410 1:CAS:528:DC%2BD1MXhsFOmsbs%3D 10.1007/s11664-008-0633-y
- (2009) J. Electron. Mater. , vol.38 , pp. 410
- You, T.¹ Kim, Y.² Kim, J.³ Lee, J.⁴ Jung, B.⁵ Moon, J.⁶ Choe, H.⁷

38
- 47049114291
- 1:CAS:528:DC%2BD2sXpsVGhu7k%3D 10.1007/s11837-007-0085-5
- W Liu N-C Lee 2007 JOM 59 7 26 1:CAS:528:DC%2BD2sXpsVGhu7k%3D 10.1007/s11837-007-0085-5
- (2007) JOM , vol.59 , Issue.7 , pp. 26
- Liu, W.¹ Lee, N.-C.²

39
- 35348904983
- IEEE Reno, NV. 10.1109/ECTC.2007.373796
- B. Huang, H.-S. Hwang, and N.-C. Lee, Proceedings of the 57th Electronic Components and Technology Conference (Reno, NV: IEEE, 2007), p. 184.
- (2007) Proceedings of the 57th Electronic Components and Technology Conference , pp. 184
- Huang, B.¹ Hwang, H.-S.² Lee, N.-C.³

40
- 33845574127
- IEEE Singapore. 10.1109/EPTC.2005.1614403
- C. Birzer, B. Rakow, R. Steiner, and J. Walter, Proceedings of the 7th Electronics Packaging Technology Conference (Singapore: IEEE, 2005), p. 255.
- (2005) Proceedings of the 7th Electronics Packaging Technology Conference , pp. 255
- Birzer, C.¹ Rakow, B.² Steiner, R.³ Walter, J.⁴

41
- 50249126081
- IEEE Singapore. 10.1109/EPTC.2006.342711
- X.J. Zhao, J.F.J.M. Caers, J.W.C.D. Vries, J. Kloostermanc, E.H. Wong, and R. Rajoo, Proceedings of the 8th Electronics Packaging Technology Conference (Singapore: IEEE, 2006), p. 174.
- (2006) Proceedings of the 8th Electronics Packaging Technology Conference , pp. 174
- Zhao, X.J.¹ Jfjm, C.² Jwcd, V.³ Kloostermanc, J.⁴ Wong, E.H.⁵ Rajoo, R.⁶

42
- 35348876553
- IEEE Reno, NV. 10.1109/ECTC.2007.374010
- D. Kim, D. Suh, T. Millard, H. Kim, C. Kumar, M. Zhu, and Y. Xu, Proceedings of the 57th Electronic Components and Technology Conference (Reno, NV: IEEE, 2007), p. 1614.
- (2007) Proceedings of the 57th Electronic Components and Technology Conference , pp. 1614
- Kim, D.¹ Suh, D.² Millard, T.³ Kim, H.⁴ Kumar, C.⁵ Zhu, M.⁶ Xu, Y.⁷

43
- 34247145459
- D Suh DW Kim P Liu H Kim JA Weninger CM Kumar A Prasad BW Grimsley HB Tejada 2007 Mater. Sci. Eng. A 460-461 595
- (2007) Mater. Sci. Eng. A , vol.460-461 , pp. 595
- Suh, D.¹ Kim, D.W.² Liu, P.³ Kim, H.⁴ Weninger, J.A.⁵ Kumar, C.M.⁶ Prasad, A.⁷ Grimsley, B.W.⁸ Tejada, H.B.⁹

44
- 63049090466
- IEEE Singapore. 10.1109/EPTC.2008.4763572
- W. Kittidacha, A. Kanjanavikat, and K. Vattananiyom, Proceedings of the 10th Electronics Packaging Technology Conference (Singapore: IEEE, 2008), p. 1074.
- (2008) Proceedings of the 10th Electronics Packaging Technology Conference , pp. 1074
- Kittidacha, W.¹ Kanjanavikat, A.² Vattananiyom, K.³

45
- 2342640135
- 1:CAS:528:DC%2BD2cXjt1ers78%3D 10.1007/s11664-004-0138-2
- Y Kariya T Hossi S Terashima M Tanaka M Otsuka 2004 J. Electron. Mater. 33 321 1:CAS:528:DC%2BD2cXjt1ers78%3D 10.1007/s11664-004-0138-2
- (2004) J. Electron. Mater. , vol.33 , pp. 321
- Kariya, Y.¹ Hossi, T.² Terashima, S.³ Tanaka, M.⁴ Otsuka, M.⁵

46
- 84861382152
- D.A.-A. Shnawah, M.F.M. Sabri, I.A. Badruddin, and F.X. Che, Microelectron. Int. 29, 108 (2012).
- (2012) Microelectron. Int. , vol.29 , pp. 108
- Shnawah, D.A.-A.¹ Sabri, M.F.M.² Badruddin, I.A.³ Che, F.X.⁴

47
- 2442443049
- 1:CAS:528:DC%2BD2cXjsVGrtbo%3D 10.2320/matertrans.45.673
- S Terashima Y Kariya M Tanaka 2004 Mater. Trans. 45 673 1:CAS:528:DC%2BD2cXjsVGrtbo%3D 10.2320/matertrans.45.673
- (2004) Mater. Trans. , vol.45 , pp. 673
- Terashima, S.¹ Kariya, Y.² Tanaka, M.³

48
- 33845597333
- IEEE San Diego, CA. 10.1109/ECTC.2006.1645629
- M. Tanaka, T. Sasaki, T. Kobayashi, and K. Tatsumi, Proceedings of the 56th Electronic Components and Technology Conference (San Diego, CA: IEEE, 2006), p. 78.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 78
- Tanaka, M.¹ Sasaki, T.² Kobayashi, T.³ Tatsumi, K.⁴

49
- 51349099022
- IEEE Lake Buena Vista, FL. 10.1109/ECTC.2008.4550261
- R. Pandher and R. Healey, Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2008), p. 2018.
- (2008) Proceedings of the 58th Electronic Components and Technology Conference , pp. 2018
- Pandher, R.¹ Healey, R.²

50
- 60849092235
- 10.1016/j.microrel.2008.10.001 1:CAS:528:DC%2BD1MXisFertLw%3D
- J-M Song L-W Lin Y-S Lai Y-T Chiu N-C Lee J-Y Uan 2009 Microelectron. Reliab. 49 235 10.1016/j.microrel.2008.10.001 1:CAS:528:DC%2BD1MXisFertLw%3D
- (2009) Microelectron. Reliab. , vol.49 , pp. 235
- Song, J.-M.¹ Lin, L.-W.² Lai, Y.-S.³ Chiu, Y.-T.⁴ Lee, N.-C.⁵ Uan, J.-Y.⁶

51
- 60449094759
- 1:CAS:528:DC%2BD1MXhtVWlsrw%3D 10.1007/s10853-008-3125-9
- H Ma JC Suhling 2009 J. Mater. Sci. 44 1141 1:CAS:528: DC%2BD1MXhtVWlsrw%3D 10.1007/s10853-008-3125-9
- (2009) J. Mater. Sci. , vol.44 , pp. 1141
- Ma, H.¹ Suhling, J.C.²

52
- 85010718699
- IEEE Rimini
- G. Henshall, R. Healey, R.S. Pandher, K. Sweatman, K. Howell, R. Coyle, T. Sack, P. Snugovsky, S. Tisdale, F. Hua, and G. O'Malley, Proceedings of the European Microelectronics and Packaging Conference (Rimini: IEEE, 2009), p. 1.
- (2009) Proceedings of the European Microelectronics and Packaging Conference , pp. 1
- Henshall, G.¹ Healey, R.² Pandher, R.S.³ Sweatman, K.⁴ Howell, K.⁵ Coyle, R.⁶ Sack, T.⁷ Snugovsky, P.⁸ Tisdale, S.⁹ Hua, F.¹⁰ O'Malley, G.¹¹

53
- 51349101863
- IEEE Lake Buena Vista, FL
- A. Syed, J. Scanlan, S. Cha, W. Kang, E. Sohn, T. Kim, and C.G. Ryu, Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2007), p. 1453.
- (2007) Proceedings of the 58th Electronic Components and Technology Conference , pp. 1453
- Syed, A.¹ Scanlan, J.² Cha, S.³ Kang, W.⁴ Sohn, E.⁵ Kim, T.⁶ Ryu, C.G.⁷

54
- 24644452125
- IEEE Lake Buena Vista, FL
- A. Lal, E. Bradley, and J. Sharda, Proceedings of the 55th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2005), p. 945.
- (2005) Proceedings of the 55th Electronic Components and Technology Conference , pp. 945
- Lal, A.¹ Bradley, E.² Sharda, J.³

55
- 55349088925
- 1:CAS:528:DC%2BD1MXht1ersLY%3D 10.3365/met.mat.2008.10.649
- JH Lee A-M Yu J-H Kim M-S Kim N Kang 2008 Met. Mater. Int. 14 649 1:CAS:528:DC%2BD1MXht1ersLY%3D 10.3365/met.mat.2008.10.649
- (2008) Met. Mater. Int. , vol.14 , pp. 649
- Lee, J.H.¹ Yu, A.-M.² Kim, J.-H.³ Kim, M.-S.⁴ Kang, N.⁵

56
- 80052682780
- 1:CAS:528:DC%2BC3MXos1aktro%3D 10.1007/s12540-011-0634-x
- A-M Yu M-S Kim C-W Lee J-H Lee 2011 Met. Mater. Int. 17 521 1:CAS:528:DC%2BC3MXos1aktro%3D 10.1007/s12540-011-0634-x
- (2011) Met. Mater. Int. , vol.17 , pp. 521
- Yu, A.-M.¹ Kim, M.-S.² Lee, C.-W.³ Lee, J.-H.⁴

57
- 0033747819
- 10.1016/S0927-796X(00)00010-3
- M Abtew G Selvaduray 2000 Mater. Sci. Eng. R 27 95 10.1016/S0927-796X(00) 00010-3
- (2000) Mater. Sci. Eng. R , vol.27 , pp. 95
- Abtew, M.¹ Selvaduray, G.²

58
- 84865262727
- CE Ho SC Yang CR Kao 2006 J. Mater. Sci. 18 155
- (2006) J. Mater. Sci. , vol.18 , pp. 155
- Ho, C.E.¹ Yang, S.C.² Kao, C.R.³

59
- 84865225849
- IEEE: Ulsan
- L. Yang, S. Fenglian, and L. Xiaojing, Proceedings of International Forum on Strategic Technology (IEEE: Ulsan, 2010), p. 1.
- (2010) Proceedings of International Forum on Strategic Technology , pp. 1
- Yang, L.¹ Fenglian, S.² Xiaojing, L.³

60
- 38349185014
- 1:CAS:528:DC%2BD1cXktVKhtLs%3D 10.1007/BF03027912
- A-M Yu C-W Lee M-S Kim J-H Lee 2007 Met. Mater. Int. 13 517 1:CAS:528:DC%2BD1cXktVKhtLs%3D 10.1007/BF03027912
- (2007) Met. Mater. Int. , vol.13 , pp. 517
- Yu, A.-M.¹ Lee, C.-W.² Kim, M.-S.³ Lee, J.-H.⁴

61
- 0003481317
- McGraw-Hill New York
- J.S. Hwang, Modern Solder Technology for Competitive Electronics Manufacturing (New York: McGraw-Hill, 1996).
- (1996) Modern Solder Technology for Competitive Electronics Manufacturing
- Hwang, J.S.¹

62
- 79952194051
- 1:CAS:528:DC%2BC3MXjslWrsQ%3D%3D 10.1007/s10853-010-5231-8
- F Cheng F Gao J Zhang W Jin X Xiao 2011 J. Mater. Sci. 46 3424 1:CAS:528:DC%2BC3MXjslWrsQ%3D%3D 10.1007/s10853-010-5231-8
- (2011) J. Mater. Sci. , vol.46 , pp. 3424
- Cheng, F.¹ Gao, F.² Zhang, J.³ Jin, W.⁴ Xiao, X.⁵

63
- 42949141515
- Taylor and Francis Boca Raton, FL
- W.F. Hosford, Physical Metallurgy (Boca Raton, FL: Taylor and Francis, 2005).
- (2005) Physical Metallurgy
- Hosford, W.F.¹

64
- 0141959740
- 6 Butterworth-Heinemann Oxford
- R.F. Smallman and R.J. Bishop, Modern Physical Metallurgy and Materials Engineering, 6th ed. (Oxford: Butterworth-Heinemann, 1999).
- (1999) Modern Physical Metallurgy and Materials Engineering
- Smallman, R.F.¹ Bishop, R.J.²

65
- 33646806201
- American Technical Homewood, IL
- D.K. Allen, Metallurgy Theory and Practice (Homewood, IL: American Technical, 1969).
- (1969) Metallurgy Theory and Practice
- Allen, D.K.¹

66
- 33846453285
- 1:CAS:528:DC%2BD2sXms1eksQ%3D%3D 10.1007/s11664-006-0326-3
- J-M Song C-F Huang H-Y Chuang 2006 J. Electron. Mater. 35 2154 1:CAS:528:DC%2BD2sXms1eksQ%3D%3D 10.1007/s11664-006-0326-3
- (2006) J. Electron. Mater. , vol.35 , pp. 2154
- Song, J.-M.¹ Huang, C.-F.² Chuang, H.-Y.³

67
- 19944429204
- 1:CAS:528:DC%2BD2MXhsVGn 10.1007/s11664-004-0083-0
- LP Lehman SN Athavale TZ Fullem AC Giamis RK Kinyanjui M Lowenstein K Mather R Patel D Rae J Wang Y Xing L Zavalij P Borgesen EJ Cotts 2004 J. Electron. Mater. 33 1429 1:CAS:528:DC%2BD2MXhsVGn 10.1007/s11664-004-0083-0
- (2004) J. Electron. Mater. , vol.33 , pp. 1429
- Lehman, L.P.¹ Athavale, S.N.² Fullem, T.Z.³ Giamis, A.C.⁴ Kinyanjui, R.K.⁵ Lowenstein, M.⁶ Mather, K.⁷ Patel, R.⁸ Rae, D.⁹ Wang, J.¹⁰ Xing, Y.¹¹ Zavalij, L.¹² Borgesen, P.¹³ Cotts, E.J.¹⁴

68
- 0034297162
- 1:CAS:528:DC%2BD3cXnsFOqsbw%3D 10.1007/s11664-000-0003-x
- KW Moon WJ Boettinger UR Kattner FS Biancaniello CA Handwerker 2000 J. Electron. Mater. 29 1122 1:CAS:528:DC%2BD3cXnsFOqsbw%3D 10.1007/s11664-000-0003- x
- (2000) J. Electron. Mater. , vol.29 , pp. 1122
- Moon, K.W.¹ Boettinger, W.J.² Kattner, U.R.³ Biancaniello, F.S.⁴ Handwerker, C.A.⁵

69
- 33846448736
- 10.1007/s11664-006-0316-5
- HW Chang K Chang JY Chen 2006 J. Electron. Mater. 35 2074 10.1007/s11664-006-0316-5
- (2006) J. Electron. Mater. , vol.35 , pp. 2074
- Chang, H.W.¹ Chang, K.² Chen, J.Y.³

70
- 14644399784
- 1:CAS:528:DC%2BD2MXhsFKktbY%3D 10.1007/s11664-005-0224-0
- AR Fix GA López I Brauer W Nüchter EJ Mittemeijer 2005 J. Electron. Mater. 34 137 1:CAS:528:DC%2BD2MXhsFKktbY%3D 10.1007/s11664-005-0224-0
- (2005) J. Electron. Mater. , vol.34 , pp. 137
- Fix, A.R.¹ López, G.A.² Brauer, I.³ Nüchter, W.⁴ Mittemeijer, E.J.⁵

71
- 0034297729
- 1:CAS:528:DC%2BD3cXnsFOqsb0%3D 10.1007/s11664-000-0004-9
- I Ohnuma M Miyashita K Anzai XJ Liu H Ohtani R Kainuma K Ishida 2000 J. Electron. Mater. 29 1137 1:CAS:528:DC%2BD3cXnsFOqsb0%3D 10.1007/s11664-000-0004- 9
- (2000) J. Electron. Mater. , vol.29 , pp. 1137
- Ohnuma, I.¹ Miyashita, M.² Anzai, K.³ Liu, X.J.⁴ Ohtani, H.⁵ Kainuma, R.⁶ Ishida, K.⁷

72
- 72549110835
- 1:CAS:528:DC%2BD1MXhsV2jtrzI 10.1007/s11664-009-0932-y
- B Arfaei E Cotts 2009 J. Electron. Mater. 38 2617 1:CAS:528: DC%2BD1MXhsV2jtrzI 10.1007/s11664-009-0932-y
- (2009) J. Electron. Mater. , vol.38 , pp. 2617
- Arfaei, B.¹ Cotts, E.²

73
- 33845698380
- 1:CAS:528:DC%2BD28XhtlWntLrN 10.1007/s10854-006-9012-8
- D Swenson 2007 J. Mater. Sci. Mater. Electron. 18 39 1:CAS:528: DC%2BD28XhtlWntLrN 10.1007/s10854-006-9012-8
- (2007) J. Mater. Sci. Mater. Electron. , vol.18 , pp. 39
- Swenson, D.¹

74
- 77951025514
- 1:CAS:528:DC%2BC3cXitlKhtLY%3D 10.1007/s11664-010-1080-0
- JW Elmer ED Specht M Kumar 2010 J. Electron. Mater. 39 273 1:CAS:528:DC%2BC3cXitlKhtLY%3D 10.1007/s11664-010-1080-0
- (2010) J. Electron. Mater. , vol.39 , pp. 273
- Elmer, J.W.¹ Specht, E.D.² Kumar, M.³

75
- 11344271682
- 1:CAS:528:DC%2BD2MXhsVKk 10.1007/s11664-004-0096-8
- A LaLonde D Emelander J Jeannette C Larson W Rietz D Swenson DW Henderson 2004 J. Electron. Mater. 33 1545 1:CAS:528:DC%2BD2MXhsVKk 10.1007/s11664-004- 0096-8
- (2004) J. Electron. Mater. , vol.33 , pp. 1545
- Lalonde, A.¹ Emelander, D.² Jeannette, J.³ Larson, C.⁴ Rietz, W.⁵ Swenson, D.⁶ Henderson, D.W.⁷

76
- 51349121097
- 1:CAS:528:DC%2BD1cXhtlyjtLbJ 10.1108/09540910810902651
- M Reid J Punch M Collins C Ryan 2008 Solder. Surf. Mt. Technol. 20 3 1:CAS:528:DC%2BD1cXhtlyjtLbJ 10.1108/09540910810902651
- (2008) Solder. Surf. Mt. Technol. , vol.20 , pp. 3
- Reid, M.¹ Punch, J.² Collins, M.³ Ryan, C.⁴

77
- 0033222086
- 1:CAS:528:DyaK1MXntlKgtb8%3D 10.1007/s11664-999-0166-z
- Y Kariya Y Hirata M Otsuka 1999 J. Electron. Mater. 28 1263 1:CAS:528:DyaK1MXntlKgtb8%3D 10.1007/s11664-999-0166-z
- (1999) J. Electron. Mater. , vol.28 , pp. 1263
- Kariya, Y.¹ Hirata, Y.² Otsuka, M.³

78
- 0036867861
- 10.1007/s11664-002-0018-6
- F Zhang M Li B Balakrisman WT Chen 2002 J. Electron. Mater. 31 1256 10.1007/s11664-002-0018-6
- (2002) J. Electron. Mater. , vol.31 , pp. 1256
- Zhang, F.¹ Li, M.² Balakrisman, B.³ Chen, W.T.⁴

79
- 6444235760
- 10.1016/j.microrel.2004.04.020 1:CAS:528:DC%2BD2cXosFSmtbY%3D
- WH Muller 2004 Microelectron. Reliab. 44 1901 10.1016/j.microrel.2004.04. 020 1:CAS:528:DC%2BD2cXosFSmtbY%3D
- (2004) Microelectron. Reliab. , vol.44 , pp. 1901
- Muller, W.H.¹

80
- 4944219736
- 1:CAS:528:DC%2BD2cXnvFehsbY%3D 10.1007/s11664-004-0026-9
- PT Vianco JA Rejent PF Hlava 2004 J. Electron. Mater. 33 991 1:CAS:528:DC%2BD2cXnvFehsbY%3D 10.1007/s11664-004-0026-9
- (2004) J. Electron. Mater. , vol.33 , pp. 991
- Vianco, P.T.¹ Rejent, J.A.² Hlava, P.F.³

81
- 77953321995
- 1:CAS:528:DC%2BC3cXkt1Wqsro%3D 10.1007/s10854-010-0086-y
- G Zeng S Xue L Zhang L Gao W Dai J Luo 2010 J. Mater. Sci. Mater. Electron. 21 421 1:CAS:528:DC%2BC3cXkt1Wqsro%3D 10.1007/s10854-010-0086-y
- (2010) J. Mater. Sci. Mater. Electron. , vol.21 , pp. 421
- Zeng, G.¹ Xue, S.² Zhang, L.³ Gao, L.⁴ Dai, W.⁵ Luo, J.⁶

82
- 20344388336
- 10.1016/j.mser.2005.03.001 1:CAS:528:DC%2BD2MXlt1WisLs%3D
- T Laurila V Vuorinen JK Kivilahti 2005 Mater. Sci. Eng. R 49 1 10.1016/j.mser.2005.03.001 1:CAS:528:DC%2BD2MXlt1WisLs%3D
- (2005) Mater. Sci. Eng. R , vol.49 , pp. 1
- Laurila, T.¹ Vuorinen, V.² Kivilahti, J.K.³

83
- 14644440514
- 1:CAS:528:DC%2BD2MXhsFKktbc%3D 10.1007/s11664-005-0225-z
- MN Islam A Sharif YC Chan 2005 J. Electron. Mater. 34 143 1:CAS:528:DC%2BD2MXhsFKktbc%3D 10.1007/s11664-005-0225-z
- (2005) J. Electron. Mater. , vol.34 , pp. 143
- Islam, M.N.¹ Sharif, A.² Chan, Y.C.³

84
- 33750199591
- 1:CAS:528:DC%2BD28XhtVOht7%2FI 10.1007/s11664-006-0163-4
- F-J Wang F Gao X Ma Y-Y Qian 2006 J. Electron. Mater. 35 1818 1:CAS:528:DC%2BD28XhtVOht7%2FI 10.1007/s11664-006-0163-4
- (2006) J. Electron. Mater. , vol.35 , pp. 1818
- Wang, F.-J.¹ Gao, F.² Ma, X.³ Qian, Y.-Y.⁴

85
- 35248860213
- 1:CAS:528:DC%2BD2sXht1Cku7vM 10.1007/s11664-007-0254-x
- MG Cho SK Kang D-Y Shih HM Lee 2007 J. Electron. Mater. 36 1501 1:CAS:528:DC%2BD2sXht1Cku7vM 10.1007/s11664-007-0254-x
- (2007) J. Electron. Mater. , vol.36 , pp. 1501
- Cho, M.G.¹ Kang, S.K.² Shih, D.-Y.³ Lee, H.M.⁴

86
- 80051589185
- 1:CAS:528:DC%2BC3MXmsFajsLg%3D 10.1007/s11664-011-1646-5
- J-M Wang K-J Wang J-G Duh 2011 J. Electron. Mater. 40 1549 1:CAS:528:DC%2BC3MXmsFajsLg%3D 10.1007/s11664-011-1646-5
- (2011) J. Electron. Mater. , vol.40 , pp. 1549
- Wang, J.-M.¹ Wang, K.-J.² Duh, J.-G.³

87
- 7044228256
- 1:CAS:528:DC%2BD2cXosVyms7o%3D 10.1007/s11664-004-0111-0
- G-Y Jang J-W Lee J-G Duh 2004 J. Electron. Mater. 33 1103 1:CAS:528:DC%2BD2cXosVyms7o%3D 10.1007/s11664-004-0111-0
- (2004) J. Electron. Mater. , vol.33 , pp. 1103
- Jang, G.-Y.¹ Lee, J.-W.² Duh, J.-G.³

88
- 7044284834
- 1:CAS:528:DC%2BD2cXosVyms7Y%3D 10.1007/s11664-004-0115-9
- CN Liao CT Wei 2004 J. Electron. Mater. 33 1137 1:CAS:528: DC%2BD2cXosVyms7Y%3D 10.1007/s11664-004-0115-9
- (2004) J. Electron. Mater. , vol.33 , pp. 1137
- Liao, C.N.¹ Wei, C.T.²

89
- 0020125253
- 1:CAS:528:DyaL38Xit1equ7c%3D 10.1016/0001-6160(82)90201-2
- KN Tu RD Thompson 1982 Acta Mater. 30 947 1:CAS:528:DyaL38Xit1equ7c%3D 10.1016/0001-6160(82)90201-2
- (1982) Acta Mater. , vol.30 , pp. 947
- Tu, K.N.¹ Thompson, R.D.²

90
- 11344295794
- 1:CAS:528:DC%2BD2MXhsVKi 10.1007/s11664-004-0090-1
- IE Anderson JL Harringa 2004 J. Electron. Mater. 33 1485 1:CAS:528:DC%2BD2MXhsVKi 10.1007/s11664-004-0090-1
- (2004) J. Electron. Mater. , vol.33 , pp. 1485
- Anderson, I.E.¹ Harringa, J.L.²

91
- 54949113898
- 1:CAS:528:DC%2BD1cXht1ykur%2FP 10.1007/s11664-008-0540-2
- SL Ngoh W Zhou JHL Pang 2008 J. Electron. Mater. 37 1843 1:CAS:528:DC%2BD1cXht1ykur%2FP 10.1007/s11664-008-0540-2
- (2008) J. Electron. Mater. , vol.37 , pp. 1843
- Ngoh, S.L.¹ Zhou, W.² Pang, J.H.L.³

92
- 0035484214
- 1:CAS:528:DC%2BD3MXns1Wlt7c%3D 10.1007/s11664-001-0118-8
- S Ahat M Sheng L Luo 2001 J. Electron. Mater. 30 1317 1:CAS:528:DC%2BD3MXns1Wlt7c%3D 10.1007/s11664-001-0118-8
- (2001) J. Electron. Mater. , vol.30 , pp. 1317
- Ahat, S.¹ Sheng, M.² Luo, L.³

93
- 77954620634
- 1:CAS:528:DC%2BC3cXotlWmt7o%3D 10.1007/s11664-010-1201-9
- C Yu Y Yang H Lu JM Chen 2010 J. Electron. Mater. 39 1309 1:CAS:528:DC%2BC3cXotlWmt7o%3D 10.1007/s11664-010-1201-9
- (2010) J. Electron. Mater. , vol.39 , pp. 1309
- Yu, C.¹ Yang, Y.² Lu, H.³ Chen, J.M.⁴

94
- 37249016980
- 1:CAS:528:DC%2BD1cXmtV2isg%3D%3D 10.1007/s11664-007-0234-1
- F Gao H Nishikawa T Takemoto 2008 J. Electron. Mater. 37 45 1:CAS:528:DC%2BD1cXmtV2isg%3D%3D 10.1007/s11664-007-0234-1
- (2008) J. Electron. Mater. , vol.37 , pp. 45
- Gao, F.¹ Nishikawa, H.² Takemoto, T.³

95
- 78049530863
- 1:CAS:528:DC%2BC3cXhtlaksrjF 10.1007/s11664-010-1371-5
- C-F Tseng K-J Wang J-G Duh 2010 J. Electron. Mater. 39 2522 1:CAS:528:DC%2BC3cXhtlaksrjF 10.1007/s11664-010-1371-5
- (2010) J. Electron. Mater. , vol.39 , pp. 2522
- Tseng, C.-F.¹ Wang, K.-J.² Duh, J.-G.³

96
- 33845594178
- IEEE San Diego, CA
- L. Xu and J.H.L. Pang, Proceedings of the 56th Electronic Components and Technology Conference (San Diego, CA: IEEE, 2006), p. 275.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 275
- Xu, L.¹ Pang, J.H.L.²

97
- 51249164221
- 1:CAS:528:DyaK2cXltl2hsrY%3D 10.1007/BF02651371
- W Yang RW Messler Jr L Felton 1994 J. Electron. Mater. 23 765 1:CAS:528:DyaK2cXltl2hsrY%3D 10.1007/BF02651371
- (1994) J. Electron. Mater. , vol.23 , pp. 765
- Yang, W.¹ Messler Jr., R.W.² Felton, L.³

98
- 28844454324
- 1:CAS:528:DC%2BD2MXosVehtbk%3D 10.1557/JMR.2005.0275
- DQ Yu CML Wu DP He N Zhao L Wang JKL Lai 2005 J. Mater. Res. 20 2205 1:CAS:528:DC%2BD2MXosVehtbk%3D 10.1557/JMR.2005.0275
- (2005) J. Mater. Res. , vol.20 , pp. 2205
- Yu, D.Q.¹ Wu, C.M.L.² He, D.P.³ Zhao, N.⁴ Wang, L.⁵ Lai, J.K.L.⁶

99
- 0034256164
- 1:CAS:528:DC%2BD3cXlsFOltbw%3D 10.1557/JMR.2000.0242
- JW Jang CY Liu PG Kim KN Tu AK Mal DR Frear 2000 J. Mater. Res. 15 1679 1:CAS:528:DC%2BD3cXlsFOltbw%3D 10.1557/JMR.2000.0242
- (2000) J. Mater. Res. , vol.15 , pp. 1679
- Jang, J.W.¹ Liu, C.Y.² Kim, P.G.³ Tu, K.N.⁴ Mal, A.K.⁵ Frear, D.R.⁶

100
- 0035455153
- 1:CAS:528:DC%2BD3MXntFWqtr0%3D 10.1007/s11664-001-0144-6
- A Zribi A Clark L Zavalij P Borgesen EJ Cotts 2001 J. Electron. Mater. 30 1157 1:CAS:528:DC%2BD3MXntFWqtr0%3D 10.1007/s11664-001-0144-6
- (2001) J. Electron. Mater. , vol.30 , pp. 1157
- Zribi, A.¹ Clark, A.² Zavalij, L.³ Borgesen, P.⁴ Cotts, E.J.⁵

101
- 42649143812
- 1:CAS:528:DC%2BD1cXlsFChtrk%3D 10.1016/j.microrel.2007.05.002
- CK Wong JHL Pang JW Tew BK Lok HJ Lu FL Ng YF Sun 2008 Microelectron. Reliab. 48 611 1:CAS:528:DC%2BD1cXlsFChtrk%3D 10.1016/j.microrel.2007.05.002
- (2008) Microelectron. Reliab. , vol.48 , pp. 611
- Wong, C.K.¹ Pang, J.H.L.² Tew, J.W.³ Lok, B.K.⁴ Lu, H.J.⁵ Ng, F.L.⁶ Sun, Y.F.⁷

102
- 32644448202
- 1:CAS:528:DC%2BD28Xht1Omu78%3D 10.1007/s11664-006-0202-1
- ML Huang T Loeher D Manessis L Boettcher A Ostmann H Reichl 2006 J. Electron. Mater. 35 181 1:CAS:528:DC%2BD28Xht1Omu78%3D 10.1007/s11664-006-0202-1
- (2006) J. Electron. Mater. , vol.35 , pp. 181
- Huang, M.L.¹ Loeher, T.² Manessis, D.³ Boettcher, L.⁴ Ostmann, A.⁵ Reichl, H.⁶

103
- 59449094167
- 1:CAS:528:DC%2BD1MXhtlSls7o%3D 10.1007/s11665-008-9276-7
- KS Lin HY Huang CP Chou 2009 J. Mater. Eng. Perform. 18 182 1:CAS:528:DC%2BD1MXhtlSls7o%3D 10.1007/s11665-008-9276-7
- (2009) J. Mater. Eng. Perform. , vol.18 , pp. 182
- Lin, K.S.¹ Huang, H.Y.² Chou, C.P.³

104
- 7044228178
- 1:CAS:528:DC%2BD2cXosVymsLg%3D 10.1007/s11664-004-0123-9
- CN Hwang K Suganuma M Kiso S Hashimoto 2004 J. Electron. Mater. 33 1200 1:CAS:528:DC%2BD2cXosVymsLg%3D 10.1007/s11664-004-0123-9
- (2004) J. Electron. Mater. , vol.33 , pp. 1200
- Hwang, C.N.¹ Suganuma, K.² Kiso, M.³ Hashimoto, S.⁴

105
- 0036642259
- 10.1016/S0026-2714(02)00068-9
- MO Alam YC Chan KC Hung 2002 Microelectron. Reliab. 42 1065 10.1016/S0026-2714(02)00068-9
- (2002) Microelectron. Reliab. , vol.42 , pp. 1065
- Alam, M.O.¹ Chan, Y.C.² Hung, K.C.³

106
- 1642330858
- 1:CAS:528:DC%2BD2cXkvF2itL4%3D 10.1108/09540910410517031
- M Arra T Castello D Shangguan E Ristolainen 2004 Solder. Surf. Mt. Technol. 16 35 1:CAS:528:DC%2BD2cXkvF2itL4%3D 10.1108/09540910410517031
- (2004) Solder. Surf. Mt. Technol. , vol.16 , pp. 35
- Arra, M.¹ Castello, T.² Shangguan, D.³ Ristolainen, E.⁴

107
- 77249172898
- IEEE Shanghai
- J. Mao, B. Liu, M. Li, Y. Wang, and D. Mao, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging (Shanghai: IEEE, 2008), p. 1.
- (2008) Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging , pp. 1
- Mao, J.¹ Liu, B.² Li, M.³ Wang, Y.⁴ Mao, D.⁵

108
- 35348912923
- IEEE Singapore. 10.1109/EPTC.2006.342750
- A. Syed, T.S. Kim, Y.M. Cho, C.W. Kim, and M. Yoo, Proceedings of the 8th Electronics Packaging Technology Conference (Singapore: IEEE, 2006), p. 404.
- (2006) Proceedings of the 8th Electronics Packaging Technology Conference , pp. 404
- Syed, A.¹ Kim, T.S.² Cho, Y.M.³ Kim, C.W.⁴ Yoo, M.⁵

109
- 70349683448
- 10.1535/itj.1201.01
- MP Renavikar N Patel A Dani V Wakharkar G Arrigotti V Vasudevan O Bchir AP Alur CK Gurumurthy RW Stage 2008 Intel Technol. J. 12 1 10.1535/itj.1201.01
- (2008) Intel Technol. J. , vol.12 , pp. 1
- Renavikar, M.P.¹ Patel, N.² Dani, A.³ Wakharkar, V.⁴ Arrigotti, G.⁵ Vasudevan, V.⁶ Bchir, O.⁷ Alur, A.P.⁸ Gurumurthy, C.K.⁹ Stage, R.W.¹⁰

110
- 33845588217
- IEEE San Diego, CA. 10.1109/ECTC.2006.1645625
- J.H.L. Pang and F.X. Che, Proceedings of the 56th Electronic Components and Technology Conference (San Diego, CA: IEEE, 2006), p. 49.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 49
- Pang, J.H.L.¹ Che, F.X.²

111
- 35348814909
- IEEE Reno, NV. 10.1109/ECTC.2007.373868
- R.S. Pandher, B.G. Lewis, R. Vangaveti, and B. Singh, Proceedings of the 57th Electronic Components and Technology Conference (Reno, NV: IEEE, 2007), p. 669.
- (2007) Proceedings of the 57th Electronic Components and Technology Conference , pp. 669
- Pandher, R.S.¹ Lewis, B.G.² Vangaveti, R.³ Singh, B.⁴

112
- 35348848383
- IEEE Reno, NV. 10.1109/ECTC.2007.373913
- H. Kim, M. Zhang, C.M. Kumar, D. Suh, P. Liu, D. Kim, M. Xie, and Z. Wang, Proceedings of the 57th Electronic Components and Technology Conference (Reno, NV: IEEE, 2007), p. 962.
- (2007) Proceedings of the 57th Electronic Components and Technology Conference , pp. 962
- Kim, H.¹ Zhang, M.² Kumar, C.M.³ Suh, D.⁴ Liu, P.⁵ Kim, D.⁶ Xie, M.⁷ Wang, Z.⁸

113
- 50249156377
- IEEE Shanghai. 10.1109/ICEPT.2007.4441562
- J.C.B. Lee, P.C. Chen, and Y.-S. Lai, Proceedings of the 8th Electronics Packaging Technology Conference (Shanghai: IEEE, 2007), p. 1.
- (2007) Proceedings of the 8th Electronics Packaging Technology Conference , pp. 1
- Lee, J.C.B.¹ Chen, P.C.² Lai, Y.-S.³

114
- 84865256192
- Accessed 20 April 2012
- http://www.univie.ac.at/cost531/. Accessed 20 April 2012.

115
- 77956619074
- 1:CAS:528:DC%2BC3cXhtFOntrvL 10.1016/j.jallcom.2010.07.160
- FX Che WH Zhu ESW Poh XW Zhang XR Zhang 2010 J. Alloy. Compd. 507 215 1:CAS:528:DC%2BC3cXhtFOntrvL 10.1016/j.jallcom.2010.07.160
- (2010) J. Alloy. Compd. , vol.507 , pp. 215
- Che, F.X.¹ Zhu, W.H.² Poh, E.S.W.³ Zhang, X.W.⁴ Zhang, X.R.⁵

116
- 0024054439
- 10.1016/0025-5416(88)90547-2
- RO Ritchie 1988 Mater. Sci. Eng. A 103 15 10.1016/0025-5416(88)90547-2
- (1988) Mater. Sci. Eng. A , vol.103 , pp. 15
- Ritchie, R.O.¹

117
- 33845700856
- 1:CAS:528:DC%2BD28XhtlWntLrO 10.1007/s10854-006-9021-7
- DR Frear 2007 J. Mater. Sci. Mater. Electron. 18 319 1:CAS:528: DC%2BD28XhtlWntLrO 10.1007/s10854-006-9021-7
- (2007) J. Mater. Sci. Mater. Electron. , vol.18 , pp. 319
- Frear, D.R.¹

118
- 51249178947
- 1:CAS:528:DyaL1cXhslajtbw%3D 10.1007/BF02652148
- DR Frear D Grivas JW Morris 1988 J. Electron. Mater. 17 171 1:CAS:528:DyaL1cXhslajtbw%3D 10.1007/BF02652148
- (1988) J. Electron. Mater. , vol.17 , pp. 171
- Frear, D.R.¹ Grivas, D.² Morris, J.W.³

119
- 51249173665
- 1:CAS:528:DyaK3cXisVartg%3D%3D 10.1007/BF02657518
- DR Frear D Grivas JW Morris 1989 J. Electron. Mater. 18 671 1:CAS:528:DyaK3cXisVartg%3D%3D 10.1007/BF02657518
- (1989) J. Electron. Mater. , vol.18 , pp. 671
- Frear, D.R.¹ Grivas, D.² Morris, J.W.³

120
- 34247137610
- 1:CAS:528:DC%2BD2sXksVeqsbY%3D 10.1016/j.actamat.2007.01.028
- S Park R Dhakal L Lehman E Cotts 2007 Acta Mater. 55 3253 1:CAS:528:DC%2BD2sXksVeqsbY%3D 10.1016/j.actamat.2007.01.028
- (2007) Acta Mater. , vol.55 , pp. 3253
- Park, S.¹ Dhakal, R.² Lehman, L.³ Cotts, E.⁴

121
- 33845896801
- MA Matin WP Vellinga MGD Geers 2007 Mater. Sci. Eng. A 445-446 73
- (2007) Mater. Sci. Eng. A , vol.445-446 , pp. 73
- Matin, M.A.¹ Vellinga, W.P.² Geers, M.G.D.³

122
- 78651275560
- IEEE Berlin. 10.1109/ESTC.2010.5642843
- T.T. Mattila, M. Mueller, M. Paulasto-Krockel, and K.-J. Wolter, Proceedings of the 3rd Electronic System-Integration Technology Conference (Berlin: IEEE, 2010), p. 1.
- (2010) Proceedings of the 3rd Electronic System-Integration Technology Conference , pp. 1
- Mattila, T.T.¹ Mueller, M.² Paulasto-Krockel, M.³ Wolter, K.-J.⁴

123
- 78649451482
- 1:CAS:528:DC%2BC3cXhsVygsbbJ 10.1016/j.microrel.2010.07.011
- JS Karppinen J Li TT Mattila M Paulasto-Kröckel 2010 Microelectron. Reliab. 50 1994 1:CAS:528:DC%2BC3cXhsVygsbbJ 10.1016/j.microrel.2010.07.011
- (2010) Microelectron. Reliab. , vol.50 , pp. 1994
- Karppinen, J.S.¹ Li, J.² Mattila, T.T.³ Paulasto-Kröckel, M.⁴

124
- 78049529833
- 1:CAS:528:DC%2BC3cXhtlaksrbN 10.1007/s11664-010-1348-4
- T-K Lee B Zhou L Blair K-C Liu TR Bieler 2010 J. Electron. Mater. 39 2588 1:CAS:528:DC%2BC3cXhtlaksrbN 10.1007/s11664-010-1348-4
- (2010) J. Electron. Mater. , vol.39 , pp. 2588
- Lee, T.-K.¹ Zhou, B.² Blair, L.³ Liu, K.-C.⁴ Bieler, T.R.⁵

125
- 0036865875
- 1:CAS:528:DC%2BD38XptVemtbo%3D 10.1007/s11664-002-0009-7
- BA Cook IE Anderson JL Harringa RL Terpstra 2002 J. Electron. Mater. 31 1190 1:CAS:528:DC%2BD38XptVemtbo%3D 10.1007/s11664-002-0009-7
- (2002) J. Electron. Mater. , vol.31 , pp. 1190
- Cook, B.A.¹ Anderson, I.E.² Harringa, J.L.³ Terpstra, R.L.⁴

126
- 70349751731
- 1:CAS:528:DC%2BD1MXnsVWrtLs%3D 10.1007/s11837-009-0085-8
- I Dutta P Kumar G Subbarayan 2009 JOM 61 6 29 1:CAS:528: DC%2BD1MXnsVWrtLs%3D 10.1007/s11837-009-0085-8
- (2009) JOM , vol.61 , Issue.6 , pp. 29
- Dutta, I.¹ Kumar, P.² Subbarayan, G.³

127
- 82955233151
- 1:CAS:528:DC%2BC3MXhtlyktLrK 10.1007/s11664-011-1760-4
- XP Li JM Xia MB Zhou X Ma XP Zhang 2011 J. Electron. Mater. 40 2425 1:CAS:528:DC%2BC3MXhtlyktLrK 10.1007/s11664-011-1760-4
- (2011) J. Electron. Mater. , vol.40 , pp. 2425
- Li, X.P.¹ Xia, J.M.² Zhou, M.B.³ Ma, X.⁴ Zhang, X.P.⁵

128
- 56749132923
- 1:CAS:528:DC%2BD1MXnsVGlsbY%3D 10.1179/136217108X336270
- S Terashima T Kobayashi M Tanaka 2008 Sci. Technol. Weld. Join. 13 732 1:CAS:528:DC%2BD1MXnsVGlsbY%3D 10.1179/136217108X336270
- (2008) Sci. Technol. Weld. Join. , vol.13 , pp. 732
- Terashima, S.¹ Kobayashi, T.² Tanaka, M.³

129
- 68249141803
- 10.1179/136217109X437169 1:CAS:528:DC%2BC3cXht1Kis7w%3D
- S Terashima M Tanaka 2009 Sci. Technol. Weld. Join. 14 768 10.1179/136217109X437169 1:CAS:528:DC%2BC3cXht1Kis7w%3D
- (2009) Sci. Technol. Weld. Join. , vol.14 , pp. 768
- Terashima, S.¹ Tanaka, M.²

130
- 0027625145
- 10.1016/0921-5093(93)90306-Y
- T Watanabe 1993 Mater. Sci. Eng. A 166 11 10.1016/0921-5093(93)90306-Y
- (1993) Mater. Sci. Eng. A , vol.166 , pp. 11
- Watanabe, T.¹

131
- 28844452526
- T Watanabe 2005 Mater. Sci. Eng. A 410-411 140
- (2005) Mater. Sci. Eng. A , vol.410-411 , pp. 140
- Watanabe, T.¹

132
- 23144455436
- 10.1016/j.scriptamat.2005.06.034 1:CAS:528:DC%2BD2MXmvFGjur4%3D
- MA Matin EWC Coenen WP Vellinga MGD Geers 2005 Scr. Mater. 52 927 10.1016/j.scriptamat.2005.06.034 1:CAS:528:DC%2BD2MXmvFGjur4%3D
- (2005) Scr. Mater. , vol.52 , pp. 927
- Matin, M.A.¹ Coenen, E.W.C.² Vellinga, W.P.³ Geers, M.G.D.⁴

133
- 43249090649
- 1:CAS:528:DC%2BD1cXksFWmur4%3D 10.1179/174329308X271788
- S Terashima M Tanaka K Tatsumi 2008 Sci. Technol. Weld. Join. 13 60 1:CAS:528:DC%2BD1cXksFWmur4%3D 10.1179/174329308X271788
- (2008) Sci. Technol. Weld. Join. , vol.13 , pp. 60
- Terashima, S.¹ Tanaka, M.² Tatsumi, K.³

134
- 17144387501
- 10.1007/s11664-005-0207-1
- B Li YW Shi YP Lei F Guo ZD Xia B Zong 2005 J. Electron. Mater. 34 217 10.1007/s11664-005-0207-1
- (2005) J. Electron. Mater. , vol.34 , pp. 217
- Li, B.¹ Shi, Y.W.² Lei, Y.P.³ Guo, F.⁴ Xia, Z.D.⁵ Zong, B.⁶

135
- 0036809677
- 1:CAS:528:DC%2BD38Xos1Shtr4%3D 10.1007/s11664-002-0052-4
- ZG Chen YW Shi ZD Xia YF Yan 2002 J. Electron. Mater. 31 1122 1:CAS:528:DC%2BD38Xos1Shtr4%3D 10.1007/s11664-002-0052-4
- (2002) J. Electron. Mater. , vol.31 , pp. 1122
- Chen, Z.G.¹ Shi, Y.W.² Xia, Z.D.³ Yan, Y.F.⁴

136
- 34547410784
- 1:CAS:528:DC%2BD2sXpt12ku70%3D 10.1007/s11664-007-0138-0
- H Hao J Tian YW Shi YP Lei ZD Xia 2007 J. Electron. Mater. 36 766 1:CAS:528:DC%2BD2sXpt12ku70%3D 10.1007/s11664-007-0138-0
- (2007) J. Electron. Mater. , vol.36 , pp. 766
- Hao, H.¹ Tian, J.² Shi, Y.W.³ Lei, Y.P.⁴ Xia, Z.D.⁵

137
- 4944260315
- 1:CAS:528:DC%2BD2cXnvFehsbs%3D 10.1007/s11664-004-0023-z
- ZG Chen YW Shi ZD Xia YF Yan 2004 J. Electron. Mater. 33 964 1:CAS:528:DC%2BD2cXnvFehsbs%3D 10.1007/s11664-004-0023-z
- (2004) J. Electron. Mater. , vol.33 , pp. 964
- Chen, Z.G.¹ Shi, Y.W.² Xia, Z.D.³ Yan, Y.F.⁴

138
- 0036737374
- 1:CAS:528:DC%2BD38XntFOktLk%3D 10.1007/s11664-002-0184-6
- CML Wu DQ Yu CMT Law L Wang 2002 J. Electron. Mater. 31 921 1:CAS:528:DC%2BD38XntFOktLk%3D 10.1007/s11664-002-0184-6
- (2002) J. Electron. Mater. , vol.31 , pp. 921
- Wu, C.M.L.¹ Yu, D.Q.² Law, C.M.T.³ Wang, L.⁴

139
- 0037326871
- 1:CAS:528:DC%2BD3sXhtFalurc%3D 10.1007/s11664-003-0238-4
- CML Wu DQ Yu CMT Law L Wang 2003 J. Electron. Mater. 32 63 1:CAS:528:DC%2BD3sXhtFalurc%3D 10.1007/s11664-003-0238-4
- (2003) J. Electron. Mater. , vol.32 , pp. 63
- Wu, C.M.L.¹ Yu, D.Q.² Law, C.M.T.³ Wang, L.⁴

140
- 77953138466
- 1:CAS:528:DC%2BC3cXmsVeisLk%3D 10.1016/j.jallcom.2010.03.179
- B-I Noh J-H Choi J-W Yoon S-B Jung 2010 J. Alloy. Compd. 499 154 1:CAS:528:DC%2BC3cXmsVeisLk%3D 10.1016/j.jallcom.2010.03.179
- (2010) J. Alloy. Compd. , vol.499 , pp. 154
- Noh, B.-I.¹ Choi, J.-H.² Yoon, J.-W.³ Jung, S.-B.⁴

141
- 0036840248
- 1:CAS:528:DC%2BD38Xot1eqtrk%3D 10.1016/S0167-577X(02)00672-9
- L Wang DQ Yu J Zhao ML Huang 2002 Mater. Lett. 56 1039 1:CAS:528:DC%2BD38Xot1eqtrk%3D 10.1016/S0167-577X(02)00672-9
- (2002) Mater. Lett. , vol.56 , pp. 1039
- Wang, L.¹ Yu, D.Q.² Zhao, J.³ Huang, M.L.⁴

142
- 1642324965
- 10.1016/j.mser.2004.01.001 1:CAS:528:DC%2BD2cXitlGktb4%3D
- CML Wu DQ Yu CMT Law L Wang 2004 Mater. Sci. Eng. R 44 1 10.1016/j.mser.2004.01.001 1:CAS:528:DC%2BD2cXitlGktb4%3D
- (2004) Mater. Sci. Eng. R , vol.44 , pp. 1
- Wu, C.M.L.¹ Yu, D.Q.² Law, C.M.T.³ Wang, L.⁴

143
- 78449299514
- IEEE Xi'an
- X. Liu, L. Wang, J. Wang, and Y. Lv, Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging (Xi'an: IEEE, 2010), p. 176.
- (2010) Proceedings of the 11th International Conference on Electronic Packaging Technology & High Density Packaging , pp. 176
- Liu, X.¹ Wang, L.² Wang, J.³ Lv, Y.⁴

144
- 51349127878
- IEEE Lake Buena Vista, FL
- W. Liu, P. Bachorik, and N.-C. Lee, Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2008), p. 452.
- (2008) Proceedings of the 58th Electronic Components and Technology Conference , pp. 452
- Liu, W.¹ Bachorik, P.² Lee, N.-C.³

145
- 77955510771
- 1:CAS:528:DC%2BC3cXpvVGmsbs%3D 10.1016/j.mee.2010.04.007
- L Gao S Xue L Zhang Z Sheng F Ji W Dai S-l Yu G Zeng 2010 Microelectron. Eng. 87 2025 1:CAS:528:DC%2BC3cXpvVGmsbs%3D 10.1016/j.mee.2010.04.007
- (2010) Microelectron. Eng. , vol.87 , pp. 2025
- Gao, L.¹ Xue, S.² Zhang, L.³ Sheng, Z.⁴ Ji, F.⁵ Dai, W.⁶ S-L, Y.⁷ Zeng, G.⁸

146
- 70349666702
- IEEE San Diego, CA. 10.1109/ECTC.2009.5074134
- W. Liu, N.C. Lee, A. Porras, M. Ding, A. Gallagher, A. Huang, S. Chen, and J.C.-B. Lee, Proceedings of the 59th Electronic Components and Technology Conference (San Diego, CA: IEEE, 2009), p. 994.
- (2009) Proceedings of the 59th Electronic Components and Technology Conference , pp. 994
- Liu, W.¹ Lee, N.C.² Porras, A.³ Ding, M.⁴ Gallagher, A.⁵ Huang, A.⁶ Chen, S.⁷ Jc-B, L.⁸

147
- 79956372355
- 1:CAS:528:DC%2BC3MXmsVWlurk%3D 10.1016/j.jallcom.2011.03.164
- E Hodulova M Palcut E Lechovic B Simekova K Ulrich 2011 J. Alloy. Compd. 509 7052 1:CAS:528:DC%2BC3MXmsVWlurk%3D 10.1016/j.jallcom.2011.03.164
- (2011) J. Alloy. Compd. , vol.509 , pp. 7052
- Hodulova, E.¹ Palcut, M.² Lechovic, E.³ Simekova, B.⁴ Ulrich, K.⁵

148
- 77955190907
- IEEE Las Vegas, NV. 10.1109/ECTC.2010.5490796
- Z. Cai, Y. Zhang, J.C. Suhling, P. Lall, R.W. Johnson, and M.J. Bozack, Proceedings of the 60th Electronic Components and Technology Conference (Las Vegas, NV: IEEE, 2010), p. 1493.
- (2010) Proceedings of the 60th Electronic Components and Technology Conference , pp. 1493
- Cai, Z.¹ Zhang, Y.² Suhling, J.C.³ Lall, P.⁴ Johnson, R.W.⁵ Bozack, M.J.⁶

149
- 0035901438
- 1:CAS:528:DC%2BD3MXjt12gs7o%3D 10.1016/S1359-6462(01)00670-4
- PL Liu JK Shang 2001 Scr. Mater. 44 1019 1:CAS:528:DC%2BD3MXjt12gs7o%3D 10.1016/S1359-6462(01)00670-4
- (2001) Scr. Mater. , vol.44 , pp. 1019
- Liu, P.L.¹ Shang, J.K.²

150
- 0032207630
- 1:CAS:528:DyaK1cXntlKhs7w%3D 10.1007/s11664-998-0074-7
- Y Kariya M Otsuka 1998 J. Electron. Mater. 27 1229 1:CAS:528: DyaK1cXntlKhs7w%3D 10.1007/s11664-998-0074-7
- (1998) J. Electron. Mater. , vol.27 , pp. 1229
- Kariya, Y.¹ Otsuka, M.²

151
- 0033333757
- 1:CAS:528:DyaK1MXmvVSgsbs%3D 10.1007/s11664-999-0251-3
- PT Vianco JA Rejent 1999 J. Electron. Mater. 28 1138 1:CAS:528: DyaK1MXmvVSgsbs%3D 10.1007/s11664-999-0251-3
- (1999) J. Electron. Mater. , vol.28 , pp. 1138
- Vianco, P.T.¹ Rejent, J.A.²

152
- 0000278386
- 1:CAS:528:DyaK1cXkvVyku7s%3D 10.1007/s11664-998-0111-6
- Y Kariya M Otsuka 1998 J. Electron. Mater. 27 866 1:CAS:528: DyaK1cXkvVyku7s%3D 10.1007/s11664-998-0111-6
- (1998) J. Electron. Mater. , vol.27 , pp. 866
- Kariya, Y.¹ Otsuka, M.²

153
- 33846457376
- 1:CAS:528:DC%2BD2sXms1eltA%3D%3D 10.1007/s11664-006-0319-2
- M He VL Acoff 2006 J. Electron. Mater. 35 2098 1:CAS:528: DC%2BD2sXms1eltA%3D%3D 10.1007/s11664-006-0319-2
- (2006) J. Electron. Mater. , vol.35 , pp. 2098
- He, M.¹ Acoff, V.L.²

154
- 84865234442
- IEEE Daejeon
- A.-M. Yu, C.-W. Lee, J.-H. Kim, M.-S. Kim, and J.-H. Lee, Proceedings of the International Conference on Electronic Materials and Packaging (Daejeon: IEEE, 2007), p. 1.
- (2007) Proceedings of the International Conference on Electronic Materials and Packaging , pp. 1
- Yu, A.-M.¹ Lee, C.-W.² Kim, J.-H.³ Kim, M.-S.⁴ Lee, J.-H.⁵

155
- 0036867860
- 1:CAS:528:DC%2BD38XptVemtLY%3D 10.1007/s11664-002-0003-0
- XJ Liu Y Inohana Y Takaku I Ohnuma R Kainuma K Ishida Z Moser W Gasior J Pstrus 2002 J. Electron. Mater. 31 1139 1:CAS:528:DC%2BD38XptVemtLY%3D 10.1007/s11664-002-0003-0
- (2002) J. Electron. Mater. , vol.31 , pp. 1139
- Liu, X.J.¹ Inohana, Y.² Takaku, Y.³ Ohnuma, I.⁴ Kainuma, R.⁵ Ishida, K.⁶ Moser, Z.⁷ Gasior, W.⁸ Pstrus, J.⁹

156
- 77951024049
- 1:CAS:528:DC%2BC3cXitlKhtLg%3D 10.1007/s11664-009-1070-2
- J Sopousek M Palcut EH Lova J Janovec 2010 J. Electron. Mater. 39 312 1:CAS:528:DC%2BC3cXitlKhtLg%3D 10.1007/s11664-009-1070-2
- (2010) J. Electron. Mater. , vol.39 , pp. 312
- Sopousek, J.¹ Palcut, M.² Lova, E.H.³ Janovec, J.⁴

157
- 18844387914
- 1:CAS:528:DC%2BD2MXks1Kktrs%3D 10.1016/j.jallcom.2005.01.001
- MN Islam YC Chan A Sharif MJ Rizvi 2005 J. Alloy. Compd. 396 217 1:CAS:528:DC%2BD2MXks1Kktrs%3D 10.1016/j.jallcom.2005.01.001
- (2005) J. Alloy. Compd. , vol.396 , pp. 217
- Islam, M.N.¹ Chan, Y.C.² Sharif, A.³ Rizvi, M.J.⁴

158
- 33845667231
- 1:CAS:528:DC%2BD28XhtlCltr3I 10.1016/j.scriptamat.2006.10.044
- J-M Song Z-M Wu D-A Huang 2007 Scr. Mater. 56 413 1:CAS:528: DC%2BD28XhtlCltr3I 10.1016/j.scriptamat.2006.10.044
- (2007) Scr. Mater. , vol.56 , pp. 413
- Song, J.-M.¹ Wu, Z.-M.² Huang, D.-A.³

159
- 76349103497
- 1:CAS:528:DC%2BC3cXhvFGnt7g%3D 10.1016/j.materresbull.2009.12.030
- A-M Yu JK Kim J-H Lee M-S Kim 2010 Mater. Res. Bull. 45 359 1:CAS:528:DC%2BC3cXhvFGnt7g%3D 10.1016/j.materresbull.2009.12.030
- (2010) Mater. Res. Bull. , vol.45 , pp. 359
- Yu, A.-M.¹ Kim, J.K.² Lee, J.-H.³ Kim, M.-S.⁴

160
- 77955187212
- IEEE Las Vegas, NV
- A-M Yu, J.-W. Jang, and J.-K. Kim, Proceedings of the 60th Electronic Components and Technology Conference (Las Vegas, NV: IEEE, 2010), p. 1524.
- (2010) Proceedings of the 60th Electronic Components and Technology Conference , pp. 1524
- Yu, A.-M.¹ Jang, J.-W.² Kim, J.-K.³

161
- 20344374604
- Marcel Dekker New York
- K. Suganuma, Lead-Free Soldering in Electronics: Science, Technology and Environmental Impact (New York: Marcel Dekker, 2004).
- (2004) Lead-Free Soldering in Electronics: Science, Technology and Environmental Impact
- Suganuma, K.¹

162
- 0035493703
- 10.1109/6104.980031
- D Suraski K Seelig 2001 IEEE Trans. Electron. Packag. Manuf. 24 125 10.1109/6104.980031
- (2001) IEEE Trans. Electron. Packag. Manuf. , vol.24 , pp. 125
- Suraski, D.¹ Seelig, K.²

163
- 84865268625
- IEEE Daejeon
- Y.-S. Park, Y.-M. Kwon, H.-Y. Son, J.-T. Moon, B.-W. Jeong, K.-I. Kang, and K.-W. Paik, Proceedings of the International Conference on Electronic Materials and Packaging (Daejeon: IEEE, 2007), p. 1.
- (2007) Proceedings of the International Conference on Electronic Materials and Packaging , pp. 1
- Park, Y.-S.¹ Kwon, Y.-M.² Son, H.-Y.³ Moon, J.-T.⁴ Jeong, B.-W.⁵ Kang, K.-I.⁶ Paik, K.-W.⁷

164
- 84865243469
- IEEE Penang
- K.Y. Cheong, M.C. Ng, A.B. Ismail, and L.B. Hussain, Proceedings of the 33rd International Electronic Manufacturing Technology Symposium (Penang: IEEE, 2008), p. 1.
- (2008) Proceedings of the 33rd International Electronic Manufacturing Technology Symposium , pp. 1
- Cheong, K.Y.¹ Ng, M.C.² Ismail, A.B.³ Hussain, L.B.⁴

165
- 77955111768
- GY Li BL Chen XQ Shi SCK Wong ZF Wang 2005 Thin Solid Films 238 2534
- (2005) Thin Solid Films , vol.238 , pp. 2534
- Li, G.Y.¹ Chen, B.L.² Shi, X.Q.³ Wong, S.C.K.⁴ Wang, Z.F.⁵

166
- 50249151963
- IEEE Singapore
- D.-S. Jiang, Y.-P. Wang, and C.S. Hsiao, Proceedings of the 8th Electronics Packaging Technology Conference (Singapore: IEEE, 2007), p. 385.
- (2007) Proceedings of the 8th Electronics Packaging Technology Conference , pp. 385
- Jiang, D.-S.¹ Wang, Y.-P.² Hsiao, C.S.³

167
- 0348107255
- 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7
- JY Tsai YC Hu CM Tsai CR Kao 2003 J. Electron. Mater. 32 1203 1:CAS:528:DC%2BD3sXpslSmtrk%3D 10.1007/s11664-003-0012-7
- (2003) J. Electron. Mater. , vol.32 , pp. 1203
- Tsai, J.Y.¹ Hu, Y.C.² Tsai, C.M.³ Kao, C.R.⁴

168
- 0942277781
- 10.1007/s11664-003-0111-5
- CM Chung KL Lin 2003 J. Electron. Mater. 32 1426 10.1007/s11664-003-0111- 5
- (2003) J. Electron. Mater. , vol.32 , pp. 1426
- Chung, C.M.¹ Lin, K.L.²

169
- 33745056527
- 1:CAS:528:DC%2BD28XlsVOit70%3D 10.1007/BF02692576
- H Nishikawa JY Piao T Takemoto 2006 J. Electron. Mater. 35 1127 1:CAS:528:DC%2BD28XlsVOit70%3D 10.1007/BF02692576
- (2006) J. Electron. Mater. , vol.35 , pp. 1127
- Nishikawa, H.¹ Piao, J.Y.² Takemoto, T.³

170
- 32644434009
- 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1
- IE Anderson JL Harringa 2006 J. Electron. Mater. 35 94 1:CAS:528:DC%2BD28Xht1Omtbc%3D 10.1007/s11664-006-0190-1
- (2006) J. Electron. Mater. , vol.35 , pp. 94
- Anderson, I.E.¹ Harringa, J.L.²

171
- 33745029082
- 1:CAS:528:DC%2BD28XlsVOisL0%3D 10.1007/BF02692546
- F Gao T Takemoto H Nishikawa A Komatsu 2006 J. Electron. Mater. 35 905 1:CAS:528:DC%2BD28XlsVOisL0%3D 10.1007/BF02692546
- (2006) J. Electron. Mater. , vol.35 , pp. 905
- Gao, F.¹ Takemoto, T.² Nishikawa, H.³ Komatsu, A.⁴

172
- 70450060907
- IEEE Beijing. 10.1109/ICEPT.2009.5270632
- L. Wang, F. Sun, Y. Liu, and L. Wang, Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging (Beijing: IEEE, 2009), p. 830.
- (2009) Proceedings of the International Conference on Electronic Packaging Technology & High Density Packaging , pp. 830
- Wang, L.¹ Sun, F.² Liu, Y.³ Wang, L.⁴

173
- 67349083563
- 1:CAS:528:DC%2BD1MXls1Gru7s%3D 10.1016/j.jallcom.2008.11.052
- YW Wang YW Lin CT Tu CR Kao 2009 J. Alloy. Compd. 478 121 1:CAS:528:DC%2BD1MXls1Gru7s%3D 10.1016/j.jallcom.2008.11.052
- (2009) J. Alloy. Compd. , vol.478 , pp. 121
- Wang, Y.W.¹ Lin, Y.W.² Tu, C.T.³ Kao, C.R.⁴

174
- 67349152353
- 10.1016/j.jallcom.2008.11.027 1:CAS:528:DC%2BD1MXls1KjtLk%3D
- YW Wang CC Chang CR Kao 2009 J. Alloy. Compd. 478 1 10.1016/j.jallcom. 2008.11.027 1:CAS:528:DC%2BD1MXls1KjtLk%3D
- (2009) J. Alloy. Compd. , vol.478 , pp. 1
- Wang, Y.W.¹ Chang, C.C.² Kao, C.R.³

175
- 51349145336
- IEEE Lake Buena Vista, FL. 10.1109/ECTC.2008.4550202
- W.H. Zhu, L. Xu, J.H.L. Pang, X.R. Zhang, E. Poh, Y.F. Sun, A.Y.S. Sun, C.K. Wang, and H.B. Tan, Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2008), p. 1667.
- (2008) Proceedings of the 58th Electronic Components and Technology Conference , pp. 1667
- Zhu, W.H.¹ Xu, L.² Pang, J.H.L.³ Zhang, X.R.⁴ Poh, E.⁵ Sun, Y.F.⁶ Sun, A.Y.S.⁷ Wang, C.K.⁸ Tan, H.B.⁹

176
- 33645566980
- 1:CAS:528:DC%2BD28Xjt1Sku70%3D 10.1007/BF02690535
- SK Kang D Leonard DY Shih L Gignac DW Henderson S Cho J Yu 2006 J. Electron. Mater. 35 479 1:CAS:528:DC%2BD28Xjt1Sku70%3D 10.1007/BF02690535
- (2006) J. Electron. Mater. , vol.35 , pp. 479
- Kang, S.K.¹ Leonard, D.² Shih, D.Y.³ Gignac, L.⁴ Henderson, D.W.⁵ Cho, S.⁶ Yu, J.⁷

177
- 59849122608
- 1:CAS:528:DC%2BD1MXhsFOmsbo%3D 10.1007/s11664-008-0606-1
- TH Chuang HJ Lin 2009 J. Electron. Mater. 38 420 1:CAS:528: DC%2BD1MXhsFOmsbo%3D 10.1007/s11664-008-0606-1
- (2009) J. Electron. Mater. , vol.38 , pp. 420
- Chuang, T.H.¹ Lin, H.J.²

178
- 33847338562
- 1:CAS:528:DC%2BD2sXis1Cku7k%3D 10.1016/j.matchar.2006.05.013
- A Fawzy 2007 Mater. Charact. 58 323 1:CAS:528:DC%2BD2sXis1Cku7k%3D 10.1016/j.matchar.2006.05.013
- (2007) Mater. Charact. , vol.58 , pp. 323
- Fawzy, A.¹

179
- 36449008212
- 1:CAS:528:DyaK3sXlsVCgt7s%3D 10.1063/1.109734
- M McCormack S Jin GW Kammlott HS Chen 1993 Appl. Phys. Lett. 63 15 1:CAS:528:DyaK3sXlsVCgt7s%3D 10.1063/1.109734
- (1993) Appl. Phys. Lett. , vol.63 , pp. 15
- McCormack, M.¹ Jin, S.² Kammlott, G.W.³ Chen, H.S.⁴

180
- 75149185040
- 10.1016/j.msea.2009.10.048 1:CAS:528:DC%2BC3cXhtlWrsLw%3D
- HY Song QS Zhu ZG Wang JK Shang M Lu 2010 Mater. Sci. Eng. A 527 1343 10.1016/j.msea.2009.10.048 1:CAS:528:DC%2BC3cXhtlWrsLw%3D
- (2010) Mater. Sci. Eng. A , vol.527 , pp. 1343
- Song, H.Y.¹ Zhu, Q.S.² Wang, Z.G.³ Shang, J.K.⁴ Lu, M.⁵

181
- 21344462667
- 1:CAS:528:DC%2BD2MXlvV2rtbs%3D 10.1016/j.scriptamat.2005.05.013
- F Wang X Ma Y Qian 2005 Scr. Mater. 53 699 1:CAS:528:DC%2BD2MXlvV2rtbs%3D 10.1016/j.scriptamat.2005.05.013
- (2005) Scr. Mater. , vol.53 , pp. 699
- Wang, F.¹ Ma, X.² Qian, Y.³

182
- 51349095281
- IEEE Lake Buena Vista, FL
- Y.-K. Jee, Y.-H. Xia, J. Yu, H.-W. Kang, and T.-Y. Lee, Proceedings of the 58th Electronic Components and Technology Conference (Lake Buena Vista, FL: IEEE, 2008), p. 491.
- (2008) Proceedings of the 58th Electronic Components and Technology Conference , pp. 491
- Jee, Y.-K.¹ Xia, Y.-H.² Yu, J.³ Kang, H.-W.⁴ Lee, T.-Y.⁵

183
- 77956094965
- 1:CAS:528:DC%2BC3cXhtVyqsrbO 10.1016/j.jallcom.2010.06.180
- AK Gain T Fouzder YC Chan A Sharif NB Wong WKC Yung 2010 J. Alloy. Compd. 506 216 1:CAS:528:DC%2BC3cXhtVyqsrbO 10.1016/j.jallcom.2010.06.180
- (2010) J. Alloy. Compd. , vol.506 , pp. 216
- Gain, A.K.¹ Fouzder, T.² Chan, Y.C.³ Sharif, A.⁴ Wong, N.B.⁵ Yung, W.K.C.⁶

184
- 79951884790
- IEEE Singapore. 10.1109/EPTC.2010.5702677
- Y.W. Lee, I.H. Kim, E.S. Kim, L.H. Lee, and J.T. Moon, Proceedings of the 12th Electronics Packaging Technology Conference (Singapore: IEEE, 2010), p. 429.
- (2010) Proceedings of the 12th Electronics Packaging Technology Conference , pp. 429
- Lee, Y.W.¹ Kim, I.H.² Kim, E.S.³ Lee, L.H.⁴ Moon, J.T.⁵

185
- 33947132091
- Berlin
- J. Tanaka, T. Takashima, K. Yoshimi, K. Serizawa, T. Narita, Proceedings of the Electronics Goes Green 2004+ (Berlin, 2004), p. 369.
- (2004) Proceedings of the Electronics Goes Green 2004+ , pp. 369
- Tanaka, J.¹ Takashima, T.² Yoshimi, K.³ Serizawa, K.⁴ Narita, T.⁵

186
- 33845694955
- 1:CAS:528:DC%2BD28XhtlWntLvJ 10.1007/s10854-006-9011-9
- IE Anderson 2007 J. Mater. Sci. Mater. Electron. 18 55 1:CAS:528:DC%2BD28XhtlWntLvJ 10.1007/s10854-006-9011-9
- (2007) J. Mater. Sci. Mater. Electron. , vol.18 , pp. 55
- Anderson, I.E.¹

187
- 0036866724
- 1:CAS:528:DC%2BD38XptVemtb8%3D 10.1007/s11664-002-0006-x
- IE Anderson BA Cook J Harringa RL Terpstra 2002 J. Elelctron. Mater. 31 1166 1:CAS:528:DC%2BD38XptVemtb8%3D 10.1007/s11664-002-0006-x
- (2002) J. Elelctron. Mater. , vol.31 , pp. 1166
- Anderson, I.E.¹ Cook, B.A.² Harringa, J.³ Terpstra, R.L.⁴

188
- 33845562099
- IEEE San Diego, CA. 10.1109/ECTC.2006.1645848
- I.D. Sousa, D.W. Henderson, L. Patry, S.K. Kang, and S.K. Shih, Proceedings of the 56th Electronic Components and Technology Conference (San Diego, CA: IEEE, 2006), p. 1454.
- (2006) Proceedings of the 56th Electronic Components and Technology Conference , pp. 1454
- Sousa, I.D.¹ Henderson, D.W.² Patry, L.³ Kang, S.K.⁴ Shih, S.K.⁵

189
- 0037302714
- 1:CAS:528:DC%2BD3sXjvVSms7c%3D 10.1016/S0026-2714(02)00239-1
- KS Kim H Huh K Suganuma 2003 Microelectron. Reliab. 43 259 1:CAS:528:DC%2BD3sXjvVSms7c%3D 10.1016/S0026-2714(02)00239-1
- (2003) Microelectron. Reliab. , vol.43 , pp. 259
- Kim, K.S.¹ Huh, H.² Suganuma, K.³

190
- 84867650025
- D.A.-A. Shnawah, S.B.M. Said, M.F.M. Sabri, I.A. Badruddin, and F.X. Che, Microelectron. Reliab. (2012). http://dx.doi.org/10.1016/j.microrel.2012.03. 028.
- (2012) Microelectron. Reliab.
- Shnawah, D.A.-A.¹ Said, S.B.M.² Sabri, M.F.M.³ Badruddin, I.A.⁴ Che, F.X.⁵

191
- 60849118139
- 1:CAS:528:DC%2BD1MXisVOjtLs%3D 10.1016/j.jallcom.2008.03.112
- KS Lin HY Huang CP Chou 2009 J. Alloy. Compd. 471 291 1:CAS:528:DC%2BD1MXisVOjtLs%3D 10.1016/j.jallcom.2008.03.112
- (2009) J. Alloy. Compd. , vol.471 , pp. 291
- Lin, K.S.¹ Huang, H.Y.² Chou, C.P.³

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.