Effect of intel-metallic and kirkendall voids growth on board level drop reliability for SnAgCu lead-free BGA solder joint

Proceedings - Electronic Components and Technology Conference

Volumn 2006, Issue , 2006, Pages 275-282

  Xu, Luhua ^a   Pang, John H L ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; FATIGUE OF MATERIALS; INTERMETALLICS; MAGNETRON SPUTTERING; SCANNING ELECTRON MICROSCOPY; THERMAL CYCLING;

DROP RELIABILITY; FATIGUE DAMAGE; KIRKENDALL VOID; THERMAL AGING;

SOLDERED JOINTS;

EID: 33845594178     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2006.1645659     Document Type: Conference Paper

References (13)

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