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Scripta Materialia

Volumn 53, Issue 8, 2005, Pages 927-932

Correlation between thermal fatigue and thermal anisotropy in a Pb-free solder alloy

(4) Matin, M A a Coenen, E W C a Vellinga, W P a Geers, M G D a

a EINDHOVEN UNIVERSITY OF TECHNOLOGY (Netherlands)

Author keywords

Electron backscattering diffraction (EBSD); Fatigue; Grain boundaries; Microstructure; Misorientation

Indexed keywords

ANISOTROPY; CRACKS; ELECTRON DIFFRACTION; FINITE ELEMENT METHOD; GRAIN BOUNDARIES; IMAGING TECHNIQUES; LEAD ALLOYS; MICROSCOPIC EXAMINATION; MICROSTRUCTURE; STRESSES; THERMAL EFFECTS;

ELECTRON BACKSCATTERING DIFFRACTION (EBSD); MISORIENTATION; THERMAL ANISOTROPY; THERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 23144455436 PISSN: 13596462 EISSN: None Source Type: Journal
DOI: 10.1016/j.scriptamat.2005.06.034 Document Type: Article

Times cited : (90)

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