Effect of Silver Content on the Shear Fatigue Properties of Sn-Ag-Cu Flip-Chip Interconnects

Journal of Electronic Materials

Volumn 33, Issue 4, 2004, Pages 321-328

  Kariya, Yoshiharu ^a   Hosoi, Takuya ^b   Terashima, Shinichi ^c   Tanaka, Masamoto ^c   Otsuka, Masahisa ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

^c NIPPON STEEL CORPORATION   (Japan)

Author keywords

BGA joints; Fatigue life; Flip chip; Lead free solder; Life prediction; Silver content; Sn Ag Cu

Indexed keywords

COPPER; FATIGUE OF MATERIALS; PLASTIC DEFORMATION; RELIABILITY; SILVER; SOLDERING ALLOYS; STRAIN; STRENGTH OF MATERIALS; TIN;

BGA JOINTS; LEAD-FREE SOLDERS; LIFE PREDICTION; SILVER CONTENT; SN-AG-CU;

FLIP CHIP DEVICES;

EID: 2342640135     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-004-0138-2     Document Type: Article

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