Mechanical fatigue characteristics of Sn-3.5Ag-X (X=Bi, Cu, Zn and In) solder alloys

Journal of Electronic Materials

Volumn 27, Issue 11, 1998, Pages 1229-1235

  Kariya, Yoshiharu ^a   Otsuka, Masahisa ^a  

^a SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Crack propagation; Ductility; Fatigue life; Isothermal fatigue; Lead free solder; Reliability; Sn 3.5Ag; Sn Ag Bi; Sn Ag Cu; Sn Ag In; Sn Ag Zn

Indexed keywords

COPPER; CRACK PROPAGATION; DUCTILITY; FATIGUE OF MATERIALS; FATIGUE TESTING; INDIUM; TIN ALLOYS; ZINC;

COFFIN-MANSON'S EQUATION; ISOTHERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 0032207630     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-998-0074-7     Document Type: Article

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