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Volumn 30, Issue 9, 2001, Pages 1157-1164

The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure

(5) Zribi, A a Clark, A a Zavalij, L a Borgesen, P b Cotts, E J a

a BINGHAMTON UNIVERSITY (United States)

b UNIVERSAL INSTRUMENTS CORPORATION (United States)

Author keywords

Atomic diffusion; AuNiSn; Intermetallic growth kinetics; Intermetallic growth mechanisms; Microstructure evolution; Pb free solder; SnAgCu

Indexed keywords

COPPER ALLOYS; GROWTH (MATERIALS); INTERFACES (MATERIALS); MICROSTRUCTURE; NICKEL; PHASE TRANSITIONS; REACTION KINETICS; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS;

ATOMIC DIFFUSION; INTERMETALLIC GROWTH KINETICS; LEAD FREE SOLDER; MICROSTRUCTURE EVOLUTION;

INTERMETALLICS;

EID: 0035455153 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-001-0144-6 Document Type: Article

Times cited : (120)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.