Tensile properties and wettability of SAC0307 and SAC105 low Ag lead-free solder alloys

Journal of Materials Science

Volumn 46, Issue 10, 2011, Pages 3424-3429

  Cheng, Fangjie ^a   Gao, Feng ^b   Zhang, Jianyou ^a   Jin, Wenshan ^a   Xiao, Xin ^a  

^a TIANJIN UNIVERSITY   (China)

^b Northwestern University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELONGATION RATIO; LEAD-FREE SOLDER ALLOY; SAC-SOLDERS; SN-37PB; SOLDER ALLOYS; ULTIMATE TENSILE STRENGTH;

ALLOYS; CERIUM ALLOYS; COPPER ALLOYS; SILVER ALLOYS; SOLDERING ALLOYS; TENSILE STRENGTH;

STRAIN RATE;

EID: 79952194051     PISSN: 00222461     EISSN: 15734803     Source Type: Journal    
DOI: 10.1007/s10853-010-5231-8     Document Type: Article

References (19)

1. W Hall M Keynes 1999 J Mater Sci Mater Electron 10 461 10.1023/A:1008930430875
2. KS Kim SH Huh K Suganuma 2002 Mater Sci Eng A333 106 1:CAS:528: DC%2BD38XksF2jtr8%3D
3. H Mavoori J Chin S Vaynman B Moran L Keen M Fine 1997 J Electron Mater 26 783 10.1007/s11664-997-0252-z 1:CAS:528:DyaK2sXksVSlt7Y%3D
4. D Suh DW Kim PL Liu, et al. 2007 Mater Sci Eng A460-461 595
5. Syed A, Kim T-S, Cha S-W, et al. (2007) Electronic components and technology conference, Reno, pp 951-956
6. Kin H, Zhang M, Kumar CM et al. (2007) Electronic components and technology conference, Reno, p 962
7. Zhang C-J, Chuang C-C, Chang T-C et al. (2007) Microsystems, Packaging, Assembly and Circuits Technology (IMPACT2007), Taipei, p 66
8. J-H Lee A-M Yu J-H Kim, et al. 2008 Metals Mater Inter 14 649 10.3365/met.mat.2008.10.649 1:CAS:528:DC%2BD1MXht1ersLY%3D
9. Y Kariya T Hosoi S Terashima, et al. 2004 J Electron Mater 33 321 10.1007/s11664-004-0138-2 1:CAS:528:DC%2BD2cXjt1ers78%3D
10. S Terashima Y Kariya T Hosoi, et al. 2003 J Electron Mater 32 1527 10.1007/s11664-003-0125-z 1:CAS:528:DC%2BD2cXlsV2itA%3D%3D
11. Kim D, Suh D, Millard T, et al. (2007) Electronic components and technology conference, Reno, pp 1614-1619
12. HT Ma JC Suhling 2009 J Mater Sci 44 1141 10.1007/s10853-008-3125-9 10.1007/s10853-008-3125-9 1:CAS:528:DC%2BD1MXhtVWlsrw%3D
13. HT Ma 2010 J Mater Sci 45 2351 10.1007/s10853-009-4200-6 10.1007/s10853-009-4200-6 1:CAS:528:DC%2BC3cXmt1eisQ%3D%3D
14. T-M Korhonen P Turpeinen 2004 J Electron Mater 12 1581 10.1007/s11664-004-0101-2
15. WJ Plumbridge CR Gagg 1999 J Mater Sci Mater Electron 10 461 10.1023/A:1008930430875 1:CAS:528:DyaK1MXlsVygtbs%3D
16. Kariya Y, Plumbridge WJ (2001) Proceedings of the 7th Symposium on microjoining and assembly technology in electronics, Japan Welding Society, Yokohama, p 383
17. N Bai X Chen Z Fang 2008 J Electron Mater 37 1012 10.1007/s11664-008- 0445-0 1:CAS:528:DC%2BD1cXlvVCmsbk%3D
18. F Gao H Nishikawa T Takemoto J Qu 2009 Microelectron Reliab 49 296 10.1016/j.microrel.2008.10.010 1:CAS:528:DC%2BD1MXisFertbs%3D
19. F Gao T Takemoto H Nishikawa A Komatsu 2006 J Electron Mater 35 905 10.1007/BF02692546 1:CAS:528:DC%2BD28XlsVOisL0%3D