Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys

Journal of Electronic Materials

Volumn 35, Issue 12, 2006, Pages 2098-2106

  He, M ^a   Acoff, V L ^a  

^a University of Alabama   (United States)

Author keywords

Grain size; Lead free solder; Microhardness; Microstructure; Sn Ag Bi alloys

Indexed keywords

LEAD-FREE SOLDER; SN-AG-BI ALLOYS; THERMAL AGING;

GRAIN SIZE AND SHAPE; MICROHARDNESS; MICROSTRUCTURE; PRECIPITATION (CHEMICAL); SCANNING ELECTRON MICROSCOPY; SOLDERING ALLOYS; THERMAL EFFECTS;

TIN ALLOYS;

EID: 33846457376     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-006-0319-2     Document Type: Conference Paper

References (21)

1. K. Zeng and K.N. Tu, Mater. Sci. Eng. R38, 55 (2002).
2. J.H. Lau, C.P. Wong, N.C. Lee, and S.W.R. Lee, Electronics Manufacturing with Lead-Free, Halogen-Free & Conductive-Adhesive Materials (New York: McGraw-Hill, 2003), pp. 1.1-1.22.
3. J.H. Lau, Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies (New York: McGraw-Hill, 2000), pp. 95-120.
4. X. Deng, R.S. Sidhu, P. Johnson, and N. Chawla, Metall. Mater. Trans. A 36A, 55 (2005).
5. X. Deng, G. Piotrowski, J.J. Williams, and N. Chawla, J. Electron. Mater. 32, 1403 (2003).
6. M. He, Z. Chen, and G.J. Qi, Metall. Mater. Trans. A 36A, 65 (2005).
7. J.S. Hwang, Surface Mount Technol. 15 (6), 18, 2001.
8. J.S. Hwang, Surface Mount Technol., 15 (7), 18, 2001.
9. M.F. Arenas and V.L. Acoff, J. Electron. Mater. 33, 1452 (2004).
10. K. Suganuma, Lead-Free Soldering in Electronics: Science, Technology and Environmental Impact (New York: Marcel Dekker Inc., 2004), pp. 1-90.
11. E. Bradley and J. Hranisavljevic, IEEE Trans. Electron. Packaging Manufacturing 24, 255 (2001).
12. J.L. Marshall, J. Calderon, J. Sees, G. Lucey, and J.S. Hwang, IEEE Trans. Components, Hybrids, and Manufacturing Technol. 14, 698 (1991).
13. J. Zhao, L. Qi, X. Wang, and L. Wang, J. Alloys Compd. 375, 196 (2004).
14. N. Wade, K. Wu, J. Kunii, S. Yamada, and K. Miyahara, J. Electron. Mater. 30, 1228 (2001).
15. M.F. Arenas, M. He, and V.L. Acoff, J. Electron. Mater. 35, 1530 (2006).
16. P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1127 (1999).
17. R.A. Islam, B.Y. Wu, M.O. Alam, Y.C. Chan, and W. Jillek, J. Alloys Compd. 392, 149 (2005).
18. ASM Handbook, vol. 3, Alloy Phase Diagrams (Materials Park, OH: ASM International, 1992), p. Z.106.
19. NIST, Ag-Bi-Sn ternary phase diagram, http://www. metallurgy.nist.gov/ phase/solder/agbisn-ll.jpg.
20. P.T. Vianco and J.A. Rejent, J. Electron. Mater. 28, 1138 (1999).
21. P.T. Vianco, J.A. Rejent, and A.C. Kilgo, J. Electron. Mater. 33, 1473 (2004).