SCOPUS 정보 검색 플랫폼

Science and Technology of Welding and Joining

Volumn 14, Issue 5, 2009, Pages 468-475

Effect of fine dispersoids and anisotropic nature of β-Sn on thermal fatigue properties of flip chips connected by Sn-xAg-0·5Cu (x: 1, 3 and 4 mass-%) lead free solders

(2) Terashima, S a Tanaka, M a

a NIPPON STEEL CORPORATION (Japan)

Author keywords

Crystallographic anisotropy; Intermetallic compound; Lead free solder; Orientation imaging microscopy; Sn Ag Cu; Thermal fatigue

Indexed keywords

CRYSTALLOGRAPHIC ANISOTROPY; INTERMETALLIC COMPOUND; LEAD FREE SOLDER; ORIENTATION IMAGING MICROSCOPY; SN-AG-CU;

ANISOTROPY; BRAZING; CRYSTALLOGRAPHY; DURABILITY; FATIGUE TESTING; LEAD; LEAD COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SINGLE CRYSTALS; SOLDERING ALLOYS; THERMAL FATIGUE; TIN ALLOYS; WELDING;

TIN;

EID: 68249141803 PISSN: 13621718 EISSN: 13621718 Source Type: Journal
DOI: 10.1179/136217109X437169 Document Type: Article

Times cited : (6)

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