Improved reliability of Sn-Ag-Cu-In solder alloy by the addition of minor elements

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1524-1528

  Yu, A Mi ^a   Jang, Jae Won ^a   Kim, Jun Ki ^b   Lee, Jong Hyun ^c   Kim, Mok Soon ^a  

^a Inha University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

^c Seoul National University of Science and Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

DROP IMPACT; IMPROVED RELIABILITY; INDUSTRIAL STANDARDS; LOAD DROPS; MATERIAL COST; MINOR ELEMENTS; PB-FREE SOLDER ALLOYS; SN-3.0AG-0.5CU; SN-AG-CU; SOLDER ALLOYS; WETTING BEHAVIOR;

ALLOYS; CONSUMER ELECTRONICS; COPPER ALLOYS; DROPS; LEAD; MECHANICAL PROPERTIES; RELIABILITY; SILVER; SILVER ALLOYS; SOLDERED JOINTS; SOLDERING ALLOYS; TIN ALLOYS;

TIN;

EID: 77955187212     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490792     Document Type: Conference Paper

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