Reduction of lead free solder aging effects using doped SAC alloys

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2010, Pages 1493-1511

  Cai, Zijie ^a   Zhang, Yifei ^a   Suhling, Jeffrey C ^a   Lall, Pradeep ^a   Johnson, R Wayne ^a   Bozack, Michael J ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

63SN37PB; AGING BEHAVIOR; AGING EFFECTS; AGING TEMPERATURES; AGING TIME; CREEP BEHAVIORS; CREEP COMPLIANCE; CREEP PROPERTIES; CREEP TESTS; ELECTRONIC ASSEMBLIES; ELEVATED TEMPERATURE; EUTECTIC SOLDERS; FAILURE BEHAVIORS; HIGH PERFORMANCE COMPUTING; INDUCED DEGRADATION; ISOTHERMAL AGING; LEAD FREE SOLDERS; LEAD-FREE SOLDER ALLOY; LEAD-FREE SOLDER JOINT; LEAD-FREE SOLDER MATERIALS; LONG-TERM AGING; LOWER COST; MATERIAL PROPERTY; MECHANICAL BEHAVIOR; MECHANICAL RESPONSE; ROOM TEMPERATURE; SAC ALLOY; SAC-SOLDERS; SHORT DURATIONS; SILVER CONTENT; SN-AG-CU; SNPB SOLDER; STRESS-STRAIN; TEST MATRIX; THERMAL CYCLING RELIABILITY; ULTIMATE STRENGTH;

ALLOYS; CERIUM; CERIUM ALLOYS; CERIUM COMPOUNDS; CREEP; DEGRADATION; DOPING (ADDITIVES); MANGANESE; MANGANESE COMPOUNDS; MECHANICAL PROPERTIES; RELIABILITY; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; STRAIN; STRESSES; THERMAL CYCLING; TIN; TIN ALLOYS; YIELD STRESS; ZINC;

LEAD;

EID: 77955190907     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2010.5490796     Document Type: Conference Paper

References (31)

1. Hsuan, T. C., and Lin, K. L., Effects of Aging Treatment of Mechanical Properties and Microstructure of Sn-8.5Zn- 0.5Ag-0.01Al-0.1Ga Solder," Materials Science and Engineering, A 456, pp. 202-209, 2007.
2. Chuang, C. M., Liu, T. S., Chen, L. H., "Effect of Aluminum Addition on Tensile Properties of Naturally Aged Sn-9Zn Eutectic Solder," Journal of Materials Science, Vol.37(1), pp. 191-195, 2002.
3. Xiao, Q., Nguyen, L., and Armstrong, W. D., "Aging and Creep Behavior of Sn3.9Ag0.6Cu Solder Alloy," Proceedings of the 54th Electronic Components and Technology Conference, pp. 1325-1332, 2004.
4. Xiao, Q.; Bailey, H. J.; and Armstrong, W. D., "Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy," Journal of Electronic Packaging, Vol.126(2), pp. 208-212, 2004.
5. Ding, Y., Wang, C., Tian, Y., and Li, M., "Influence of Aging on Deformation Behavior of 96.5Sn3.5Ag Lead Free Solder Alloy During In Situ Tensile Tests," Journal of Alloys and Compounds, Vo. 428, pp. 274-285, 2007.
6. Pang, J. H. L., Low, T. H., Xiong, B. S., Xu, L., and Neo, C. C.., "Thermal cycling aging effects on Sn-Ag-Cu solder joint microstructure, IMC and strength," Thin Solid Films, Vol.462-463, pp. 370-375, 2004.
7. Darveaux, R., "Shear Deformation of Lead Free Solder Joints," Proceedings of the 55th Electronic Components and Technology Conference, pp. 882-893, 2005.
8. Wiese, S., and Wolter, K. J., "Creep of Thermally Aged SnAgCu Solder Joints," Microelectronics Reliability, Vol.47, pp. 223-232, 2007.
9. Dutta, I., Pan, D., Marks, R. A., Jadhav, S. G., "Effect of Thermo-mechanically Induced Microstructural Coarsening on the Evolution of Creep Response of SnAg-based Microelectronic Solders," Materials Science and Engineering, A 410-411, pp. 48-52, 2005.
10. Medvedev, A. S., "Aging of Tin-Lead Solders and Joints Soldered by Them," Metallovedenie i Obrabotka Metallov, No.7, pp. 16-23, 1956.
11. Lampe, B. T. "Room Temperature Aging Properties of Some Solder Alloys," Welding Journal, Vol.55(10), pp. 330s- 340s, 1976.
12. Miyazawa, Y., and Ariga, T., "Microstructural Change and Hardness of Lead Free Solder Alloys," Proceedings of the First International Symposium on Environmentally Conscious Design and Inverse Manufacturing, pp. 616-619, 1999.
13. Miyazawa, Y., and Ariga T., "Influences of Aging Treatment on Microstructure and Hardness of Sn-(Ag, Bi, Zn) Eutectic Solder Alloys," Materials Transactions of the Japan Institute of Metals, Vol.42(5), pp. 776-782, 2001.
14. Chilton, A. C., Whitmore, M. A., and Hampshire, W. B., "Fatigue Failure in a Model SMD Joint," Soldering and Surface Mount Technology, Vol.3, pp. 21-24, 1989.
15. Gagliano, R. A., Fine, M. E., Vaynman, S., and Stolkarts, V., "Shear Testing of Solder Joints: The Effect of Various Parameters on the Maximum Shear Stress of Eutectic Tin- Lead Solder," Advanced Materials for the 21st Century:Proceedings of the 1999 Julia R. Weertman Symposium, pp. 107-116, Cincinnati, OH, Oct. 31-Nov. 4, 1999.
16. Coyle, R. J., Solan, P. P., Serafino, A. J., and Gahr, S. A., "The Influence of Room Temperature Aging on Ball Shear Strength and Microstructure of Area Array Solder Balls," Proceedings of the 50th Electronic Components and Technology Conference, pp. 160-169, 2000.
17. Tsui, Y. K., Lee, S. W., and Huang, X., "Experimental Investigation on the Degradation of BGA Solder Ball Shear Strength Due to Room Temperature Aging," Proceedings of the 4th International Symposium on Electronic Materials and Packaging, pp. 478-481, 2002.
18. Lee, S. W., Tsui, Y. K., Huang, X., and Yan, C. C., "Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls," Proceedings of the 2002 ASME International Mechanical Engineering Congress and Exposition, Paper IMECE2002-39514, pp. 1-4, 2002.
19. Hasegawa, K., Noudou, T., Takahashi, A., and Nakaso, A., "Thermal Aging Reliability of Solder Ball Joint for Semiconductor Package Substrate," Proceedings of the 2001 SMTA International, pp. 1-8, 2001.
20. Li, M., Lee, K. Y., Olsen, D. R., Chen, W. T., Tan, B. T. C., and Mhaisalkar, S., "Microstructure, Joint Strength and Failure Mechanisms of SnPb and Pb-Free Solders in BGA Packages," IEEE Transactions on Electronics Packaging, Vol.25(3), pp. 185-192, 2002.
21. Chou, G. J. S., "Microstructure Evolution of SnPb and SnAgCu BGA Solder Joints During Thermal Aging," Proceedings of the 8th Symposium on Advanced Packaging Materials, pp. 39-46, 2002.
22. Law, C. M. T., and Wu, C. M. L., "Microstructure Evolution and Shear Strength of Sn-3.5Ag-RE Lead Free BGA Solder Balls," Proceedings of HDP'04, pp. 60-65, 2004.
23. Chiu, T. C., Zeng, K., Stierman, R., Edwards, D., and Ano, K., "Effect of Thermal Aging on Board Level Drop Reliability for Pb-free BGA Packages," Proceedings of the 54th Electronic Components and Technology Conference, pp. 1256-1262, 2004.
24. Ding, Y., Wang, C., Li, M., and Bang, H. S., "Aging Effects on Fracture Behavior of 63Sn37Pb Eutectic Solder During Tensile Tests Under the SEM," Materials Science and Engineering, Vol.A384, pp. 314-323, 2004.
25. Ma, H., Suhling, J. C., Lall P., Bozack, M. J., "Reliability of the Aging Lead-free Solder Joint," Proceeding of the 56th Electronic Components and Technology Conference, pp. 49- 864, San Diego, California, May 30-June 2, 2006.
26. Ma, H., Suhling, J. C., Zhang, Y., Lall, P., and Bozack, M. J., "The Influence of Elevated Temperature Aging on Reliability of Lead Free Solder Joints," Proceedings of the 57th IEEE Electronic Components and Technology Conference, pp. 653-668, Reno, NV, May 29-June 1, 2007.
27. Zhang, Y., Cai, Z., Suhling, J. C., Lall, P., and Bozack, M. J., "The Effects of Aging Temperature on SAC Solder Joint Material Behavior and Reliability," Proceedings of the 58th IEEE Electronic Components and Technology Conference, pp. 99-112, Orlando, FL, May 27-30, 2008.
28. Zhao, J., Caers, J. F. J. M., de Vries, J. W. C., Kloostermanc, J., Wong, E. H., and Rajood, R., "Improvement of Mechanical Impact Resistance of BGA Packages with Pbfree Solder Bumps, Proceedings of the EPTC, pp. 174-178, 2006.
29. Liu, W., and Lee, N. C., "The Effects of Additives to SnAgCu Alloys on Microstructure and Drop Impact Reliability of Solder Joints," JOM, pp. 26-31, July 2007.
30. Pandher, R., and Healey, R., "Reliability of Pb-Free Solder Alloys in Demanding BGA and CSP Applications," Proceedings of the 58th IEEE Electronic Components and Technology Conference, pp. 2018-2023, Orlando, FL, May 27-30, 2008.
31. Lie, W., Bachorik, P., and Lee, N. C., "The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism," Proceedings of the 58th IEEE Electronic Components and Technology Conference, pp. 452-458, Orlando, FL, May 27- 30, 2008.