Effect of stress state on growth of interfacial intermetallic compounds between Sn-Ag-Cu solder and Cu substrates coated with electroless Ni immersion Au

Journal of Electronic Materials

Volumn 37, Issue 12, 2008, Pages 1843-1850

  Ngoh, S L ^a   Zhou, W ^b   Pang, J H L ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Interface; Intermetallic; Isothermal aging; Lead free solder; Sn Ag Cu; Stress effect

Indexed keywords

INTERFACE; ISOTHERMAL AGING; LEAD-FREE SOLDER; SN-AG-CU; STRESS EFFECT;

BRAZING; COMPRESSIVE STRESS; COPPER; INTERMETALLICS; LEAD; NICKEL ALLOYS; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SUBSTRATES; TENSILE STRESS; TIN; TIN ALLOYS; WELDING;

SOLDERING ALLOYS;

EID: 54949113898     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0540-2     Document Type: Article

References (35)

1. R.E. Pratt E.I. Stromswold D.J. Quesnel 1996 IEEE Trans. Compon. Packag. A 19 134
2. P.L. Tu Y.C. Chan J.K.L. Lai 1997 IEEE Trans. Compon. Packag. T 20 87
3. W.J. Plumbridge 1996 Solder Surf. Mt. Tech. 8 27 10.1108/ 09540919610777582
4. Y.C. Chan P.L. Tu A.C.K. So J.K.L. Lai 1997 IEEE Trans. Compon. Packag. B 20 463
5. K.N. Tu A.M. Gusak M. Lim 2003 J. Appl. Phys. 93 1335 10.1063/1.1517165
6. M.E. Ferguson C.D. Fieselman M.A. Elkins 1997 IEEE Trans. Compon. Packag. C 20 188
7. P.A. Kramer J.W. Morris Jr. 1994 Metall. Mater. Trans. A 25 1249 10.1007/BF02652299
8. W. Huang O.A. Palusinski D.L. Dietrich 1997 IEEE Trans. Adv. Packag. 23 277 10.1109/6040.846646
9. H.-T. Lee M.-H. Chen H.-M. Jao T.-L. Liao 2003 Mater. Sci. Eng. A-Struct. 358 134
10. P.L. Liu Z. Xu J.K. Shang 2000 Metall. Mater. Trans. A 31A 2857 10.1007/BF02830353
11. C.E. Ho S.Y. Tsai C.R. Kao 2001 IEEE Trans. Adv. Packag. 24 493 10.1109/6040.982835
12. K. Jung H. Conrad 2001 J. Electron. Mater. 30 1303 10.1007/s11664-001- 0115-y
13. K.H. Prakash T. Sritharan 2001 Acta Mater. 49 2481 10.1016/S1359-6454(01) 00146-X
14. A. Zribi A. Clark L. Zavalij P. Borgesen E.J. Cotts 2001 J. Electron. Mater. 30 1157 10.1007/s11664-001-0144-6
15. K. Zeng K.N. Tu 2002 Mater. Sci. Eng. Rep. 38 55 10.1016/S0927-796X(02) 00007-4
16. C.-W. Hwang K. Suganuma 2004 Mater. Sci. Eng. A-Struct. 373 187
17. H.K. Kim K.N. Tu 1996 Phys. Rev. B 53 16027 10.1103/PhysRevB.53.16027
18. J.-W. Yoon S.-B. Jung 2005 J. Alloy Comp. 396 122 10.1016/j.jallcom.2004. 12.009
19. A. Kumar M. He Z. Chen 2005 Solder Surf. Mt. Tech. 198 283
20. D.-G. Kim J.-W. Kim S.-B. Jung 2005 Mater. Sci. Eng. B-Solid 121 204
21. P.T. Vianco J.J. Stephens J.A. Rejent 1997 IEEE Trans. Compon. Packag. A 20 478
22. A. Zribi R.R. Chromik R. Presthus J. Clum K. Teed L. Zavalij J. DaVita J. Tova E.J. Cotts 1999 IEEE Trans. Adv. Packag. 49 451
23. H.L.J. Pang K.H. Tan X.Q. Shi Z.P. Wang 2001 Mater. Sci. Eng. A-Struct. 307 42
24. P.G. Harris K.S. Chaggar 1998 Solder Surf. Mt. Tech. 10 38 10.1108/09540919810237110
25. J.W. Jang P.G. Kim K.N. Tu 1999 J. Appl. Phys. 85 8456 10.1063/1.370627
26. F. Gua J. Lee S. Choi J.P. Lucas T.R. Bieler K.N. Subramanian 2001 J. Electron. Mater. 30 1073 10.1007/s11664-001-0132-x
27. M.R. Marks 2002 J. Electron. Mater. 31 265 10.1007/s11664-002-0142-3
28. ASTM Standard G38-01, Standard Practice for making and using C-ring stress-corrosion test specimen, ASTM International, 03.02 (for referenced ASTM standards, visit the ASTM website, www.astm.org ).
29. J.H.L. Pang B.S. Xiong 2005 IEEE Trans. Compon. Packag. Tech. 28 830 10.1109/TCAPT.2005.848587
30. M.L. Bauccio, ed., ASM Metals Reference Book, 3rd ed. (ASM International, 1993).
31. C.E. Ho R.Y. Tsai Y.L. Lin C.R. Kao 2002 J. Electron. Mater. 31 584 10.1007/s11664-002-0129-0
32. W.T. Chen C.E. Ho C.R. Kao 2002 J. Mater. Res. 17 263 10.1557/JMR.2002.0036
33. A.K. Larsson L. Stenberg S. Lidin 1994 Acta Crystallogr. B 50 636 10.1107/S0108768194004052
34. J. Bernal 1928 Nature 54 122
35. P.W. Atkins, Elements of Physical Chemistry, 3rd ed. (Oxford University Press, 2000), p. 158.