A review of board level solder joints for mobile applications

Microelectronics Reliability

Volumn 48, Issue 11-12, 2008, Pages 1747-1758

  Wong, E H ^a   Seah, S K W ^a,b   Shim, V P W ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NATIONAL UNIVERSITY OF SINGAPORE   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

BENDING (DEFORMATION); BENDING TESTS; BRAZING; BUILDING COMPONENTS; DROPS; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS INDUSTRY; FAILURE (MECHANICAL); FATIGUE DAMAGE; FATIGUE OF MATERIALS; FATIGUE TESTING; INTEGRATED CIRCUITS; LEAD; MATERIALS PROPERTIES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; PRINTED CIRCUITS; RELIABILITY; SOLDERED JOINTS; SOLDERING ALLOYS; TESTING; TIN; TITANIUM COMPOUNDS; WELDING;

COMPONENT LEVEL TESTS; COMPONENT LEVELS; CYCLIC BENDING TESTS; DAMAGE MECHANISMS; DYNAMIC STRESSES; ELECTRONIC PRODUCTS; FAILURE MODELS; FATIGUE STRENGTHS; HIGH SPEEDS; IC COMPONENTS; INTEGRATED CIRCUIT COMPONENTS; LEAD-FREE SOLDERS; LIFE PREDICTIONS; MOBILE APPLICATIONS; MODELLING AND SIMULATIONS; PCB ASSEMBLIES; PHYSICS OF FAILURES; PORTABLE ELECTRONICS; SHEAR TESTS; SHOCK CONDITIONS; SNPB SOLDERS; SOLDER JOINTS; STRAIN RATE SENSITIVITIES; TEST TEMPERATURES; WIDESPREAD USES;

STRAIN RATE;

EID: 55849123626     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.08.006     Document Type: Review

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