Interfacial reaction between Sn-0.7Cu (-Ni) solder and Cu substrate

Journal of Electronic Materials

Volumn 35, Issue 5, 2006, Pages 1127-1132

  Nishikawa, Hiroshi ^a   Piao, Jin Yu ^b,c   Takemoto, Tadashi ^a  

^a OSAKA UNIVERSITY   (Japan)

^b OSAKA UNIVERSITY   (Japan)

^c Harima Chemicals Inc   (Japan)

Author keywords

Interfacial reaction; Intermetallic compound; Lead free solder; Ni addition

Indexed keywords

INTERFACIAL REACTION; LEAD-FREE SOLDER; NI ADDITION;

AGING OF MATERIALS; COPPER; INTERMETALLICS; NICKEL; SOLDERING ALLOYS; SURFACE CHEMISTRY;

TIN ALLOYS;

EID: 33745056527     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02692576     Document Type: Conference Paper

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