Effect of reflow profiles on the board level drop reliability of Pb-free (SnAgCu) BGA assemblies

Proceedings - Electronic Components and Technology Conference

Volumn 1, Issue , 2005, Pages 945-953

  Lal, Anand ^a   Bradley, Edwin ^a   Sharda, Jignesh ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

REFLOW; REFLOW TEMPERATURE; SOLDER PASTE;

COPPER; INTERMETALLICS; NICKEL; RELIABILITY; SOLDERING ALLOYS; SUBSTRATES;

LEAD;

EID: 24644452125     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

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2. th Electronic Components and Technology Conf., 2004, pp. 1088-1094.
3. C.T. Lim and Y.J. Low, "Investigating the Drop Impact of Portable Electronics," Proc. 52nd Electronic Components and Technology Conf., 2002, pp. 1270-1274.
4. JESD22-111, Board Level Drop Test Method of Components for Handheld Electronic Products. JEDEC Solid State Technology Association, July 2003.
5. rd Electronic Components and Technology Conf., 2003, pp. 317-322.
6. M. Amagai, Y. Toyoda, T. Ohnishi, S. Akita, "High Drop Test Reliability: Lead-free Solders," Proc. 54th Electronic Components and Technology Conf., 2004, pp. 1304-1309.
7. D. Reiff and E. Bradley, "A Novel Mechanical Shock Test Method to Evaluate Lead-free BGA Solder Joint Reliability," Proc. 55rd Electronic Components and Technology Conf., 2005.
8. G.Y. Li, B.L. Chen, and J. N. Tey, "Reaction of Sn3.5Ag-0.7Cu-xSb Solder With Cu Metallization During Reflow Soldering," IEEE Transactions on Electronics Packaging Manufacturing, Vol. 27, No. 1, 2004, pp. 77-85.
9. S. K. Kang, W. K. Choi, D. Y. Shih, P. Lauro, D. W. Henderson, T. Gosselin, and D. N. Leonard, "Interfacial Reactions, Microstructure and Mechanical Properties of Pb-Free Solder Joints in PBGA Laminates," Proc. 52nd Electronic Components and Technology Conf., 2002, pp. 146-153.
10. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, "Impact Reliability of Solder Joints," Proc. 54th Electronic Components and Technology Conf., 2004, pp. 668-674.
11. U.S. Dunford, S. Canumalla, and P. Viswanadham, "Intermetallic Morphology and Damage Evolution Under Thermomechanical Fatigue of Lead-Free Solder Interconnections," Proc. 54th Electronic Components and Technology Conf., 2004, pp. 726-736.
12. E. Bradley and K. Banerji, "Effect of Thermal Aging on the Microstructure and Reliability of Ball Grid Array (BGA) Solder Joints, Proc. Surface Mount Inter., 1996, pp. 95-106.