Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys

Journal of Electronic Materials

Volumn 29, Issue 10, 2000, Pages 1122-1136

  Moon, K W ^a   Boettinger, W J ^a   Kattner, U R ^a   Biancaniello, F S ^a   Handwerker, C A ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER AIDED ANALYSIS; COMPUTER SIMULATION; DIFFERENTIAL THERMAL ANALYSIS; ENTHALPY; EUTECTICS; PHASE DIAGRAMS; SOLDERING ALLOYS; TERNARY SYSTEMS;

TIN SILVER COPPER ALLOYS;

TIN ALLOYS;

EID: 0034297162     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-000-0003-x     Document Type: Article

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