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Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1050-1059

Alloying effects in near-eutectic Sn-Ag-Cu solder alloys for improved microstructural stability

(6) Anderson, I E a Foley, J C a Cook, B A a Harringa, J a Terpstra, R L a Unal, O a

a IOWA STATE UNIVERSITY (United States)

Author keywords

Cu Sn intermetallics; Joint microstructure; Joint strength; Sn Ag Cu solder; Sn Ag eutectic solder; Thermal stability

Indexed keywords

AGING OF MATERIALS; ALLOYING; CALORIMETRY; COOLING; EUTECTICS; INTERFACES (MATERIALS); INTERMETALLICS; METALLOGRAPHIC MICROSTRUCTURE; NUCLEATION; SHEAR STRENGTH; SOLDERING ALLOYS; THERMODYNAMIC STABILITY;

AUGER ELEMENTAL MAPPING; QUATERNARY ALLOYS; SOLDER JOINTS; SOLDER MATRIX; TIN SILVER COPPER SOLDER ALLOYS;

TIN ALLOYS;

EID: 0035455514 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-001-0129-5 Document Type: Article

Times cited : (211)

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