The superior drop test performance of SAC-Ti solders and its mechanism

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2008, Pages 452-458

  Liu, Weiping ^a   Bachorik, Paul ^a   Lee, Ning Cheng ^a  

^a INDIUM CORPORATION   (United States)

Author keywords

Drop test; Fragility; Lead free; SAC; Solder; Tin silver copper

Indexed keywords

DROP TEST; FRAGILITY; LEAD-FREE; SAC; SOLDER; TIN-SILVER-COPPER;

BRAZING; COMPUTER NETWORKS; DROPS; FLUID MECHANICS; MANGANESE; MANGANESE ALLOYS; MANGANESE COMPOUNDS; MELTING POINT; METALLIC COMPOUNDS; SEMICONDUCTING INTERMETALLICS; SOLDERING ALLOYS; WELDING;

TITANIUM ALLOYS;

EID: 51349127878     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2008.4550011     Document Type: Conference Paper

References (10)

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2. D. Henderson, "On the question of SAC solder alloy - Cu pad solder joint fragility", Webcast Meeting on SAC Solder Joint Fragility, Binghamton, NY, September, 2004
3. S. K. Saha, S. Mathew and S. Canumalla, "Effect of Intermetallic Phases on Performance in a Mechanical Drop Environment: 96.5Sn3.5Ag Solder on Cu and Ni/Au Pad Finishes", ECTC, S29p5, June, 2004.
4. M. Amagai, Y. Toyoda, T. Ohnishi, S. Akita, "High Drop Test Reliability: Lead-free Solders", ECTC, S29p7, June 2004.
5. T. Gregorich and P. Holmes, J. Lee, C. Lee, "SnNi and SnNiCu Intermetallic Compounds Found When Using SnAgCu Solders", IPC/Soldertec Global 2nd International Conference on Lead Free Electronics, Amsterdam, Netherland, June 23, 2004.
6. M. Date, T. Shoji, M. Fujiyoshi, K. Sato, and K. N. Tu, "Impact Reliability of Solder Joints", ECTC, June, 2004.
7. P.A. Kondos & S. Mandke, "Kirkendall voiding in Cu pads and other pad issues", UIC Fragile SAC Joint Meeting. Binghamton, NY, Oct. 7, 2004.
8. M. Date, T. Shoji, M. Fujiyoshi, and K. Sato, "Pb-free Solder Ball with Higher Impact Reliability", Intel Pb-free Technology Forum, July 18-20, 2005, Penang, Malaysia.
9. Weiping Liu and Ning-Cheng Lee, "Novel SACX Solders with Superior Drop Test Performance", SMTA International, Chicago, IL, September, 2006
10. C. Robert Kao, "Cross-interaction between Cu and Ni in lead-free solder joints", TMS Lead Free Workshop, San Antonia, TX, March 12, 2006.