Materials Issues in Area-Array Microelectronic Packaging

JOM

Volumn 51, Issue 3, 1999, Pages 22-27

  Frear, Darrel R ^a,b  

^a SEMATECH   (United States)

^b UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; FLIP CHIP DEVICES; MICROELECTRONICS; RELIABILITY; SEMICONDUCTING SILICON; SOLDERING ALLOYS; SUBSTRATES;

LEAD-FREE SOLDER ALLOYS;

ELECTRONICS PACKAGING;

EID: 0033098524     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11837-999-0023-9     Document Type: Article

References (15)

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15. D.R. Frear and P.T. Vianco, Metall. Trans. A, 25A (1994), p. 1509.