Emerging reliability challenges in electronic packaging

IEEE International Reliability Physics Symposium Proceedings

Volumn , Issue , 2008, Pages 450-454

  Frear, D R ^a   Ramanathan, L N ^a   Jang, J W ^a   Owens, N L ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

Drop test; Electromigration; Solder reliability; Thermomechanical fatigue

Indexed keywords

DROP TEST; ELECTROMIGRATION; ELECTRONIC PACKAGING; SOLDER RELIABILITY; THERMOMECHANICAL FATIGUE;

APPLICATIONS; BRAZING; ELECTRONIC EQUIPMENT; ELECTRONICS PACKAGING; MICROELECTRONICS; MICROPROCESSOR CHIPS; SPEED; WELDING;

RELIABILITY;

EID: 51549112537     PISSN: 15417026     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/RELPHY.2008.4558927     Document Type: Conference Paper

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