Evaluation of high compliant low Ag solder alloys on OSP as a drop solution for the 2nd level Pb-free interconnection

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2007, Pages 1614-1619

  Kim, Dongwook ^a   Suh, Daewoong ^a   Millard, Thomas ^a   Kim, Hyunchul ^a   Kumar, Chetan ^a   Zhu, Mark ^a   Xu, Youren ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DOPING (ADDITIVES); ENERGY DISSIPATION; PLASTICITY; SILVER ALLOYS;

DROP RESISTANCE; INTERCONNECTION;

SOLDERING ALLOYS;

EID: 35348876553     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2007.374010     Document Type: Conference Paper

References (11)

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2. R.O. Ritchie, "Mechanisms of fatigue crack propagation in metals, ceramics and composites: role of crack tip shielding", Materi. Sci. Eng. Vo. A103, No. 1 (1988) pp. 15-28
3. G.E. Dieter, Mechanical Metallurgy, McGraw-Hill, London, 1988.
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11. K. Zeng, V. Vuorinen, J.K. kivilahti, "Interfacial reactions between lead-free SnAgCu solder and Ni(P) surface finish on printed circuit boards", IEEE Trans. Electronics Packaging Manufacturing, Vol.25, No.3 (2002) pp. 162-167.