Alloying modification of Sn-Ag-Cu solders by manganese and titanium

Microelectronics Reliability

Volumn 49, Issue 3, 2009, Pages 235-241

  Lin, Li Wei ^a   Song, Jenn Ming ^a   Lai, Yi Shao ^b   Chiu, Ying Ta ^b   Lee, Ning Cheng ^c   Uan, Jun Yen ^d  

^a NATIONAL DONG HWA UNIVERSITY   (Taiwan)

^b ADVANCED SEMICONDUCTOR ENGINEERING INC   (Taiwan)

^c INDIUM CORPORATION   (United States)

^d NATIONAL CHUNG HSING UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALLOYING; COPPER ALLOYS; DENDRIMERS; ELASTIC MODULI; EUTECTICS; MANGANESE; MANGANESE COMPOUNDS; MECHANICAL PROPERTIES; METAL REFINING; SEMICONDUCTING INTERMETALLICS; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; TIN ALLOYS; TITANIUM; TITANIUM ALLOYS;

COARSE EUTECTIC STRUCTURES; CU ALLOYS; DOPED SAMPLES; EXTENDED VOLUMES; HETEROGENEOUS COMPOUNDS; INTERMETALLIC COMPOUNDS; MICRO-STRUCTURAL CHANGES; MICROCONSTITUENTS; MINOR ALLOYING; MN-DOPED; NANO-INDENTATION TESTS; PROEUTECTIC; SN-AG-CU SOLDERS; STRENGTHENING EFFECTS; TI ADDITIVES;

TIN;

EID: 60849092235     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2008.10.001     Document Type: Article

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