Effect of Silver Content on Thermal Fatigue Life of Sn-xAg-0.5Cu Flip-Chip Interconnects

Journal of Electronic Materials

Volumn 32, Issue 12, 2003, Pages 1527-1533

  Terashima, Shinichi ^a   Kariya, Yoshiharu ^b   Hosoi, Takuya ^c   Tanaka, Masamoto ^a  

^a NIPPON STEEL CORPORATION   (Japan)

^b NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^c SHIBAURA INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

Flip chip; Lead free; Microjoining; Microstructure; Reliability; Silver content; Sn Ag Cu; Solder; Thermal fatigue

Indexed keywords

COPPER; CRACK PROPAGATION; CRACKS; FATIGUE OF MATERIALS; GRAIN SIZE AND SHAPE; INTERMETALLICS; MICROSTRUCTURE; RELIABILITY; SILVER; SOLDERED JOINTS; THERMAL CYCLING; TIN;

LEAD-FREE SOLDERS; MICROJOINING; SILVER CONTENT; SN-AG-CU; THERMAL FATIGUE;

FLIP CHIP DEVICES;

EID: 0942299489     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0125-z     Document Type: Conference Paper

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