Modeling-technique for reliability assessment of portable electronic product subjected to drop impact loads

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 100-104

  Zhu, Liping ^a  

^a ERICSSON RESEARCH   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; PORTABLE EQUIPMENT; PRODUCT DESIGN; PRODUCT DEVELOPMENT; RELIABILITY;

BALL GRID ARRAYS; PORTABLE ELECTRONIC PRODUCT; PRODUCT DROP TEST;

ELECTRONIC EQUIPMENT TESTING;

EID: 0038351732     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. Lim, C. T. et al, "Numerical Simulation of the Drop Impact Response of a Portable Electronic Product," IEEE Trans-CPMT-A, Vol. 25, No. 3 (2002), pp. 478-485.
2. Liping Zhu, "Submodeling Technique for BGA Reliability Analysis of CSP Packaging Subjected to an Impact Loads," Proc of IPACK'01-The Pacific Rim/ASME International Electronic Packaging Technical Conference and Exhibition, Kauai, Hawaii, July, 2001, IPACK2001-15873.
3. Hallquist, J. O., LS-DYNA Users Manual, LSTC, (California, 1998).
4. Liping Zhu, et al, "Modeling Approach to Simulate Drop Impact Test of Chip Scale Packages on both Board and Product Phone Levels," (to be presented on IPACK'03, Maui, Hawaii, July 2003)